Ejecting method and ejecting apparatus

ABSTRACT

In an ink jet apparatus for manufacturing a color filter  1 , ink jet heads  22  having a plurality of nozzle  27  are disposed in a linear manner. Filter element member is ejected to a motherboard  12  from a plurality of nozzles  27  four times so as to form the filter element  3  in a predetermined thickness. By doing this, it is possible to prevent difference in the thickness in a plurality of the filter elements  3  and to equalize light transparency in planar manner. Thus, in an ejecting apparatus, a color filter can be formed in more common way at low cost and more efficiently. Also, it is possible to provide an ejecting apparatus which can equalize factors such as electrooptical characteristics of the electrooptical members, color displaying characteristics by the liquid crystal apparatuses, and illuminating characteristics by an EL surface.

This is a Division of application Ser. No. 10/301,917 filed Nov. 22,2002. The disclosure of the prior application is hereby incorporated byreference herein in its entirety.

BACKGROUND

1. Field of the Invention

The present invention relates to an ejecting method for ejecting a fluidliquid material and relates to an apparatus therefor. Also, the presentinvention relates to an electrooptical apparatus such as a liquidcrystal apparatus, an electroluminescent apparatus (hereinafter calledan EL apparatus), an electrophoretic apparatus, and a plasma displaypanel apparatus (hereinafter called a PDP apparatus). Also, the presentinvention relates to a manufacturing method for an electron emissionapparatus for manufacturing electrooptical apparatuses and relates to amanufacturing apparatus therefor. Also, the present invention relates toa color filter, which is used in electrooptical apparatus, and to amanufacturing method for the color filter, and to a manufacturingapparatus therefor. Furthermore, the present invention relates to anelectrooptical member, a semiconductor apparatus, an optical member, adevice having a base member such as a reagent inspection member, amanufacturing apparatus for the device having the base member, and themanufacturing apparatus therefor.

2. Description of Related Art

Recently, display apparatuses which are electrooptical apparatuses suchas liquid display apparatuses, and an EL apparatuses are commonly usedfor display sections in electronic devices such as mobile phones, amobile computers, etc. Also, recently, it is more common for full colordisplay operation to be performed by the display apparatuses. Forexample, full color display operation by a liquid crystal apparatus isperformed by passing a light, which is modulated by a liquid crystallayer through a color filter. The color filter is formed by disposingcolor filter elements in a dot form, such as those of R (red), G(green), and B (blue), on a surface of a base board which is made from aglass member or a plastic member in a predetermined disposition methodsuch as stripe-disposition, delta-disposition, and mosaic disposition.

Also, in full color display operation by an EL apparatus, EL luminescentlayers such as those of R (red), G (green), and B (blue) in dot form aredisposed on a surface of the base board made of a glass member or aplastic member in a predetermined disposition such asstripe-disposition, delta-disposition, and mosaic disposition.Consequently, these EL luminescent layers are sandwiched by a pair ofelectrodes; thus a picture element pixel is formed. By controllingvoltage, which is applied to these electrodes for each picture elementpixel, these picture element pixels are illuminated in an intendedcolor; thus, full color display operation is realized.

Conventionally, it has been known that photolithography methods may beused for performing a patterning operation on color filter elements suchas those of R (red), G (green), and B (blue) of the color filter and apatterning operation for color picture element pixels such as those of R(red), G (green), and B (blue) of the EL apparatus. However, there wereproblems in that manufacturing processes of the photolithography methodwere complicated and large quantities of coloring materials andphotoresist were consumed; thus, manufacturing cost increased.

In order to solve this problem, a method was proposed for forming afilament which is disposed in a dot array form and an EL luminescentlayer by ejecting a filter element member and EL luminescent member in adot form by an ink jet method.

Here, a method for forming a filament and an EL luminescent layer in dotform by an ink jet method is explained. Here, a plurality of filterelements 303 which are disposed in dot form as shown in FIG. 50B areformed in an inner region of a plurality of panel areas 302 which aredisposed on a surface of a large base board which is made from a glassmember or a plastic member such as a motherboard 301 as shown in FIG.50A by ink jet method. In this case, as shown in FIG. 50C, for example,a plurality of main scanning operations (twice in FIG. 50C) areperformed on one piece of panel area 302 by an ink jet head 306 as aliquid drop ejecting head having a nozzle array 305 containing aplurality of nozzles 304 in arrays as shown by arrows A1 and A2 in FIG.50B. During the main scanning operation, by ejecting a filter materialsuch as an ink from a plurality of nozzles selectively, a filter element303 is formed in an intended position.

The filter element 303 is formed by disposing colors such as those of R,G, and B in a preferred disposition such as stripe-disposition,delta-disposition, and mosaic disposition as explained above. By doingthis, in an ink ejecting process by an ink jet head 306 as shown in FIG.50B, the ink jet head 306 for ejecting colors such as those of R, G, andB are provided for three colors in advance. Consequently, by using theseink jet heads 306 one by one, three-color disposition of R, G, and B isperformed on one motherboard 301.

However, generally, the amount of ink which is ejected by a plurality ofnozzles 304 contained in a nozzle array 305 of the ink jet head 306varies among a plurality of nozzles. This is caused by ink ejectioncharacteristics shown in FIG. 51A in which ink ejection amount ismaximum in a position which corresponds to two ends of the nozzle array305, and ink ejection amount is less in a middle position of the twoends of the nozzle array 305. Ink ejection amount is least in a positionbetween the two ends of the nozzle array 305 and the middle positionthereof.

Therefore, as shown in FIG. 50B, when a filter element 303 is formed byan ink jet head 306, dense streaks are formed on positions P1 and/or P2corresponding to both ends of the ink jet head 306 as shown in FIB. 51B.Thus, there is a problem in that planar translucency of the color filterbecomes non-uniform.

On the other hand, a plurality of panel areas 302 is formed on themotherboard 301, and it is proposed that a filter element 303 can beformed efficiently when the ink jet head is disposed in an overall areain width dimension of the motherboard 301 crossing a main scanningdirection of the ink jet head by using a longitudinal ink jet head.However, when a different size of motherboard 301 is used according tothe panel area 302, an ink jet head having a different size is necessaryfor each of the cases; thus, the cost increases.

SUMMARY

The present invention was made in consideration of the above-mentionedproblems. An object of the present invention is to provide an ejectingmethod for forming filter elements efficiently with low manufacturingcost in a more common way by using a liquid drop ejecting head such asan ink jet, and an apparatus therefor, an electrooptical apparatus andmanufacturing method therefor and a manufacturing apparatus therefor, acolor filter and manufacturing method therefor and a manufacturingapparatus therefor, a device having a base member, and controllingmethod therefor and a manufacturing apparatus therefor.

(1) The ejecting apparatus is characterized in comprising:

a liquid drop ejecting head having a plurality of nozzles aligned forejecting a fluid liquid material onto a substance to receive theejection;

a holding member for holding a surface on which a plurality of thenozzles of the liquid drop ejecting head for ejecting the liquidmaterial are disposed in line so as to face a surface of the substanceto receive the ejection having a space between the surface which has thenozzles and the surface of the substance to receive the ejection; and

a moving member which moves at least one of the holding member or thesubstance to receive the ejection relatively such that the liquid dropejecting head is along the surface of the substance to receive theejection, wherein

an array of the nozzles which are disposed on each of the liquid dropejecting heads are disposed in a direction which crosses the substanceto receive the ejection diagonally to a direction of relative movementto the substance to receive the ejection.

In the present invention, a liquid drop ejecting head having a pluralityof nozzles aligned for ejecting a fluid liquid material is movedrelatively along a surface of a substance to receive the ejection suchthat a surface on which these liquid drop ejecting heads are disposedface a surface of the substance to receive the ejection having a spacetherebetween. The same liquid material is ejected to the substance toreceive the ejection from each nozzle of a plurality of the liquid dropejecting heads. The nozzle array which is disposed on each of the liquiddrop ejecting head is disposed in a first direction which crosses adirection diagonally in which the nozzle array is moved relatively tothe substance to receive the ejection By doing this, the same liquidmaterial is ejected from nozzles of a plurality of the liquid dropejecting head which are disposed in line. Therefore, it is possible toeject a liquid material in a wide range by using an ordinary and commonspecification liquid drop ejecting head. Therefore, it is possible toreduce costs by using conventional common specification liquid dropejecting heads instead of a special design liquid drop ejecting head. Inaddition, by adjusting the number of the liquid drop ejecting headswhich are supposed to be disposed in line, it is possible to set theliquid drop ejecting head according to the positions to which the liquidmaterial is ejected. Thus, the liquid drop ejecting head can be usedmore commonly.

Also, in the present invention, it is preferable that a plurality of theliquid drop ejecting heads be disposed in a second direction whichcrosses the substance to receive the ejection diagonally to a directionof relative movement to the substance to receive the ejection. By doingthis, a plurality of the liquid drop ejecting heads are disposed so asto be diagonal to a main scanning direction in which the liquid dropejecting head is moved along a surface of the substance to receive theejection. For example, when nozzles are disposed on a line, a pitch suchas an interval at which the liquid material is ejected becomes narrowerthan a pitch between the nozzles. For example, the substance to receivethe ejection to which a liquid material is ejected is used for a displayapparatus, and the displaying condition becomes finer. Furthermore, aninterference caused between neighboring liquid drop ejecting heads canbe prevented; thus, it is possible to make the apparatus smaller.

Also, in the present invention, it is preferable that the shape of aplurality of the liquid drop ejecting heads be substantially the same aseach other. By doing this, it is possible to make the liquid dropejecting heads correspond to the area to which the liquid material isejected. Thus, the structure of the apparatus becomes simpler, and theproductivity increases, and the cost can be reduced.

In the present invention, it is preferable that each one of a pluralityof the liquid drop ejecting heads have the same number of nozzles. Bydoing this, each of a plurality of the liquid drop ejecting heads hasthe same number of nozzles, ant it is therefore easy to delineate apredetermined pattern such as a stripe, a mosaic, and delta for adisposition pattern for a plurality of liquid drop ejecting heads.

In the present invention, it is preferred that each one of a pluralityof the liquid drop ejecting heads have nozzles which are located at thesame corresponding position. By doing this, it is preferable that aposition in which nozzles of a plurality of the liquid drop ejectinghead are formed in the same positions among the liquid drop ejectingheads. By doing this, it is easy to delineate a predetermined patternsuch as a stripe, a mosaic, and delta for a disposition pattern for aplurality of liquid drop ejecting heads.

Furthermore, it is preferable that each of a plurality of the liquiddrop ejecting heads have the nozzles aligned in an array in nearly andequal interval. By doing this, the nozzles of a plurality of the liquiddrop ejecting head are aligned in an array in nearly equal interval.Therefore, it is easy to delineate a predetermined pattern such as astripe, a mosaic, and a delta for a disposition pattern for a pluralityof liquid drop ejecting heads.

Also, it is preferable that the liquid drop ejecting heads be formed innearly a rectangular shape along a direction of the nozzles which aredisposed. By doing this, the liquid drop ejecting head is formed innearly a rectangular shape along a direction of the nozzles which aredisposed; therefore, it is possible to realize a smaller liquid dropejecting head, and reduce interference of the liquid drop ejecting headby other structures. Therefore, it is possible to realize a smallerliquid drop ejecting head more easily.

Also, in the present invention, it is preferable that a plurality of theliquid drop ejecting heads be disposed in the second direction whichdiagonally crosses a direction in which the substance to receive theejection moves relatively such that the nozzles are disposed nearlyparallel with each other. By doing this, a plurality of the liquid dropejecting heads are moved relatively along a surface of the substance toreceive the ejection so as to move along a direction in which the liquiddrop ejecting head moves relatively along a surface of the substance toreceive the ejection crosses diagonally a direction in which the nozzlesare disposed nearly linearly. Therefore, the nozzles are disposeddiagonally to a main scanning direction in which a plurality of theliquid drop ejecting heads moves along a surface of the substance toreceive the ejection. Thus, a pitch with such an interval at which theliquid material is ejected becomes narrower than a pitch between thenozzles. For example, the substance to receive the ejection to which theliquid material is ejected is used for a display apparatus, anddisplaying condition becomes finer. Furthermore, an interference causedbetween neighboring liquid drop ejecting heads can be prevented; thus,it is possible to minimize the size of the apparatus.

Also, in the present invention, it is preferable that the array of thenozzles of a plurality of the liquid drop ejecting head be disposed in adirection which diagonally crosses a direction in which the nozzles moverelatively to the substance to receive the ejection, and the array ofthe nozzles of a plurality of the liquid drop ejecting head are disposedso as to be parallel with each other. By doing this, a plurality of theliquid drop ejecting heads and the nozzles are disposed in a directionwhich crosses diagonally a direction in which the liquid drop ejectingheads are moved relatively along a surface of the substance to receivethe ejection. Thus, a pitch at such an interval at which the liquidmaterial is ejected becomes narrower than a pitch between the nozzles.For example, the substance to receive the ejection to which the liquidmaterial is ejected is used for a display apparatus, and displayingcondition becomes finer. Furthermore, an interference caused betweenneighboring liquid drop ejecting heads can be prevented; thus, it ispossible to minimize the size of the apparatus. Also, a plurality ofejection areas to which the liquid material is ejected are formed easilyin one region; therefore, liquid material ejecting efficiency isimproved. Also, it is possible to eject the liquid material to oneregion in a multiple manner from the liquid drop ejecting head; thus,ejection amount can be equalized in the ejection area easily.

Also, in the present invention, it is preferable that a plurality of theliquid drop ejecting heads neighboring each other disposed in adirection of a relative movement to the substance to receive theejection so that portions of the liquid drop ejecting heads overlapseach other. By doing this, the neighboring liquid drop ejecting head aredisposed such that a portion of the liquid drop ejecting heads overlapeach other to a main scanning direction in which the liquid dropejecting heads are moved along a surface of the substance to receive theejection. Therefore, interference caused between neighboring liquid dropejecting heads can be reliably prevented; thus, it is possible tominimize the size of the apparatus.

Also, in the present invention, it is preferable that a plurality of theliquid drop ejecting heads be disposed in a staggered manner in aplurality of arrays. By doing this, the liquid drop ejecting headsneighboring each other do not interfere with each other; thus, there isno area to which the liquid material is not ejected between the liquiddrop ejecting heads. Thus, it is possible to obtain desirable ejectionof the liquid material in a continuous manner.

Also, in the present invention, it is preferable that the ejectingapparatus have an ejection detecting device for detecting the liquidmaterial which is ejected from the nozzle. By doing this, by detectingthe ejection of the liquid material from the nozzle by the ejectiondetecting device, it is possible to prevent uneven ejection of theliquid material so as to obtain desirable ejection of the liquidmaterial stably.

Also, in the present invention, it is preferable that the ejectiondetecting device detect the ejection of the liquid material in at leastone of the steps including a step for ejecting the liquid material fromthe nozzle to the substance to receive the ejection and a previous step,and a consecutive step. By doing this, by detecting the ejection of theliquid material in at least one of the steps including a step forejecting the liquid material from the nozzle to the substance to receivethe ejection and a previous step, and a consecutive step, it is possibleto detect the ejection condition of the liquid material in at least oneof the steps including a step for ejecting the liquid material from thenozzle to the substance to receive the ejection and a previous step, anda consecutive step. Therefore, it is possible to detect the ejectioncondition of the liquid material just before the ejection or immediatelyafter the ejection. Therefore, it is possible to acknowledge theejection condition of the liquid material.

(2) The present invention is preferable for manufacturing anelectrooptical apparatus by using a liquid material containing an ELluminescent member as a liquid material to be ejected and ejecting theliquid material to a substance to receive the ejection such as a baseboard so as to form the EL luminescent layer.

(3) The present invention is preferable for manufacturing anelectrooptical apparatus by using a liquid material such as a colorfilter member as a liquid material to be ejected and ejecting the liquidmaterial to one of a pair of the base boards for sandwiching the liquidcrystal as a substance to receive the ejection so as to form the colorfilter.

(4) The present invention is preferable for manufacturing a devicehaving a base member by ejecting a fluid liquid material as thesubstance to receive the ejection.

According to the present invention, a plurality of liquid drop ejectingheads having a plurality of nozzles aligned for ejecting a liquidmaterial is moved relatively along a surface of a substance to receivethe ejection such that a surface on which these nozzles are disposedface a surface of the substance to receive the ejection having a spacetherebetween. The same liquid material is ejected to the substance toreceive the ejection from each nozzle of a plurality of the liquid dropejecting head. Therefore, it is possible to eject a liquid material in awide range by using an ordinary and common specification liquid dropejecting head. Therefore, it is possible to reduce cost by using aconventional common specification liquid drop ejecting head instead of aspecial design liquid drop ejecting head. In addition, by adjusting thenumber of the liquid drop ejecting heads which are supposed to bedisposed in line, it is possible to set the liquid drop ejecting headsaccording to the positions at which the liquid material to be ejected.Thus, the liquid drop ejecting head can be used more commonly.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view graphically showing important processes in anembodiment of a manufacturing method for a color filter according to thepresent invention.

FIG. 2 is a plan view graphically showing important processes in anotherembodiment of a manufacturing method for a color filter according to thepresent invention.

FIG. 3 is a plan view graphically showing important processes in anotherembodiment of a manufacturing method for a color filter according to thepresent invention.

FIG. 4 is a plan view graphically showing important processes in anotherembodiment of a manufacturing method for a color filter according to thepresent invention.

FIGS. 5A and 5B are plan views showing an embodiment of a color filteraccording to the present invention and an embodiment of a motherboardwhich is a base for the color filter.

FIGS. 6A to 6D are cross sections graphically showing manufacturingprocesses for a color filter viewed along line VI-VI in FIG. 5A.

FIGS. 7A to 7C are views showing disposition examples of picture elementpixels for three colors such as those of R, G, and B in the colorfilter.

FIG. 8 is a perspective view showing an embodiment of the liquid dropejecting apparatus which is an important part of a manufacturingapparatus such as the color filter according to the present invention, amanufacturing apparatus for the liquid crystal apparatus according tothe present invention, and a manufacturing apparatus for an EL apparatusaccording to the present invention.

FIG. 9 is an enlarged perspective view showing an important part of theapparatus shown in FIG. 8.

FIG. 10 is an enlarged perspective view showing an ink jet head which isan important part of the apparatus shown in FIG. 9.

FIG. 11 is an enlarged perspective view showing a modified example ofthe ink jet head.

FIGS. 12A and 12B show the internal structure of the ink jet head. FIG.12A is a perspective view of an internal part of which is shown. FIG.12B is a cross section viewed along a line J-J in FIG. 12A.

FIG. 13 is a plan view showing other modified examples of the ink jethead.

FIG. 14 is a block diagram showing an electric controlling system whichis used for the ink jet head shown in FIG. 8.

FIG. 15 is a flow chart showing controlling processes which are executedby the controlling system shown in FIG. 14.

FIG. 16 is a perspective view showing a further modified example of theink jet head.

FIG. 17 is a process chart showing an embodiment of a manufacturingmethod for the liquid crystal apparatus according to the presentinvention.

FIG. 18 is a perspective view of an example of the liquid crystalapparatus which is manufactured by the manufacturing method for theliquid crystal apparatus according to the present invention in adisassembled manner.

FIG. 19 is a cross section showing a cross sectional structure of theliquid crystal apparatus viewed along line IX-IX shown in FIG. 18.

FIG. 20 is a process chart showing an embodiment of the manufacturingmethod for an EL apparatus according to the present invention.

FIGS. 21A to 21D are cross sections of the EL apparatus corresponding tothe process chart shown in FIG. 20.

FIG. 22 is a perspective view showing a liquid drop ejection processingapparatus in the liquid drop ejecting apparatus which is provided in themanufacturing apparatus for the color filter according to the presentinvention, an internal portion of which can be seen.

FIG. 23 is a plan view showing the head unit of the liquid drop ejectingprocessing apparatus.

FIG. 24 is a side view showing the head unit of the liquid drop ejectingprocessing apparatus.

FIG. 25 is a front view showing the head unit of the liquid dropejecting processing apparatus.

FIG. 26 is a cross section showing the head unit of the liquid dropejecting processing apparatus.

FIG. 27 is a perspective view showing the head apparatus in adisassembled state.

FIG. 28 is a perspective view showing the ink jet head in a disassembledstate.

FIGS. 29A to 29C are showing ejecting movement of the filter elementmember by the ink jet head.

FIG. 30 is a view for explaining ejection amount of the filter elementmember by the ink jet head.

FIG. 31 is a general view for explaining disposition condition of theink jet head.

FIG. 32 is an enlarged general view for explaining the dispositioncondition of the ink jet head.

FIGS. 33A and 33B are views showing the color filter which ismanufactured by the manufacturing apparatus for the color filtergraphically. FIG. 33A is a plan view and FIG. 33B is a cross sectionviewed along a line X-X shown in FIG. 33A.

FIGS. 34S1 to 34S7 are cross sections for explaining the manufacturingprocesses for manufacturing the color filter.

FIG. 35 is a circuit diagram showing a part of the display apparatuswhich uses the EL displaying element used in the electroopticalapparatus according to the present invention.

FIG. 36 is an enlarged plan view showing a planar structure of a pixelarea of the display apparatus.

FIGS. 37A to 37E are cross sections showing a preparatory process whichis performed before the manufacturing process of the present invention.

FIGS. 38A to 38C are cross sections showing ejecting process for the ELilluminating member in the manufacturing process for the displayapparatus.

FIGS. 39A to 39D are cross sections showing ejecting process for the ELilluminating member in the manufacturing process for the displayapparatus.

FIG. 40 is an enlarged cross section showing a planar structure of thepixel area in the display apparatus which uses the EL displaying elementfor the electrooptical apparatus according to the present invention.

FIGS. 41A and 41B are enlarged cross sections showing a planar structureof the pixel area in the display apparatus which uses the EL displayingelement for the electrooptical apparatus according to the presentinvention. FIG. 41A is a plan view and FIG. 41B is a cross sectionviewed along a line B-B shown in FIG. 41A.

FIG. 42 is a cross section showing the manufacturing process formanufacturing the display apparatus which uses the EL displaying elementfor the electrooptical apparatus according to the present invention.

FIG. 43 is a cross section showing the manufacturing process formanufacturing the display apparatus which uses the EL displaying elementfor the electrooptical apparatus according to the present invention.

FIG. 44 is a cross section showing the manufacturing process formanufacturing the display apparatus which uses the EL displaying elementfor the electrooptical apparatus according to the present invention.

FIG. 45 is a cross section showing the manufacturing process formanufacturing the display apparatus which uses the EL displaying elementfor the electrooptical apparatus according to the present invention.

FIG. 46 is a cross section showing the manufacturing process formanufacturing the display apparatus which uses the EL displaying elementfor the electrooptical apparatus according to the present invention.

FIG. 47 is a cross section showing the manufacturing process formanufacturing the display apparatus which uses the EL displaying elementfor the electrooptical apparatus according to the present invention.

FIG. 48 is a perspective view showing a personal computer as an electricdevice which is provided with the electrooptical apparatus.

FIG. 49 is a perspective view showing a mobile phone as an electricdevice which is provided with the electrooptical apparatus.

FIGS. 50A to 50C are views showing examples of a manufacturing methodfor a conventional color filter.

FIGS. 51A and 51B are views for explaining the characteristics of aconventional color filter.

DETAILED DESCRIPTION OF EMBODIMENTS

(Explanation 1 for a Manufacturing Method for a Color Filter andApparatus Therefor).

Hereinafter, a basic manufacturing method for a color filter of thepresent invention and a manufacturing apparatus therefor are explained.Firstly, before explaining the manufacturing method and a manufacturingapparatus using thereof, a color filter which is manufactured by usingthe above-mentioned manufacturing method is explained. FIG. 5A is a planview showing an embodiment of the color filter. Also, FIG. 6D is a crosssection viewed along a line IV-IV on FIG. 5A.

In a color filter 1 according to the present embodiment, a plurality offilter elements 3 are formed on a surface of a square base board 2(which can be called a “base member” in the present invention) which ismade from a glass member or a plastic member in a dot pattern such asdot matrix condition in the present embodiment. Furthermore, as shown inFIG. 6D, the color filter 1 is formed by layering a protecting layer 4on the filter element 3. Here, FIG. 5A is a plan view of the colorfilter 1 from which the protecting layer 4 is removed.

The filter element 3 is separated by a bulkhead 6 which has a gridpattern which is formed by a non-translucent resin member so as to burya plurality of square regions which are disposed in a dot matrix mannerby a color member. These filter elements 3 are one of the color memberssuch as those of R (red), G (green), or B (blue), and filter elements 3having each colors are disposed in a predetermined array arrangement.For such disposition, for example, stripe-disposition (shown in FIG.7A), mosaic disposition (shown in FIG. 7B), and delta disposition (shownin FIG. 7C) are known. Here, a word “bulkhead” is used as a meaning of“bank”. The bank indicates a side surface which protrudes from a surfaceof the base board in nearly orthogonal manner. It is acceptable if aside surface is disposed at more than 90 degrees or less than 90degrees.

The stripe disposition is defined as a disposition in which color is thesame in the vertical array of the matrix. The mosaic disposition isdefined as a disposition in which three filter elements which aredisposed on horizontal and vertical lines are three colors such as thoseof R, G, and B. Furthermore, the delta disposition is defined as adisposition in which the filter elements 3 are disposed in a staggeredmanner and any combination of the three filter elements which arerandomly selected becomes a three color combination of R, G, and B.

Size of the color filter 1 is, for example, 4.57 cm (1.8 inch). Also thesize of a piece of a filter element 3 is, for example, 30 μm×100 μm.Also, an element pitch such as an interval between each filter elements3 is, for example, 75 μm.

When a color filter 1 according to the present embodiment is used for anoptical element for performing full-color display operation, threefilter elements containing colors such as those of R, G, and B forms aunit as one color pixel. By passing a beam through one of the filterelements such as those of R, G, and B contained in one color pixel orthrough combined filter elements selectively, the full-color displayoperation can be performed. In this time, the bulkhead 6 which is madefrom a not-translucent resin member acts as a black matrix.

The above-mentioned color filter 1 is obtained by cutting a large areamotherboard 12 shown in FIG. 5B into a little pieces. More specifically,a pattern which corresponds to one piece of the color filter 1 is formedon each surface of a plurality of the color filter forming area 11 whichare disposed in the motherboard 12. Consequently, around the colorfilter forming areas 11, cutting grooves are formed. By cutting themotherboard 12 along the cutting grooves, the color filters 1 are cutinto pieces.

Hereinafter, a manufacturing method for a color filter shown in 5A and amanufacturing apparatus therefor are explained.

FIGS. 6A to 6D are cross sections showing manufacturing steps accordingto the manufacturing method for the color filter 1. First, bulkheads 6which are made from non-translucent resin member are formed on a surfaceof the motherboard 12 in a grid pattern viewed from an arrow B in thedrawing. Hole areas 7 in the grid pattern is a filter element formingarea in which the filter elements 3 are formed. Planar dimensions ofeach of the filter element forming areas 7 which are formed by thebulkheads 6 viewed in an arrow direction B is, for example, 30 μm to 100μm.

The bulkheads 6 act to prevent the liquid material such as the filterelement member 13 which is supplied to the filter element forming areas7 from flowing and for performing as a black mask. Also, the bulkheads 6are formed by any kinds of patterning method such as a photolithographymethod. If necessary, the bulkheads 6 are formed by performing a heatingprocessing so as to sinter it.

After the bulkheads 6 are formed, as shown in FIG. 6B, each filterelement forming areas are buried by the filter element members 13 bysupplying liquid drops 8 of the filter element member 13 to each filterelement forming areas 7. In FIG. 6B, reference numeral 13R indicates afilter element member having a color of R (red). Reference numeral 13Gindicates a filter element member having a color of G (green). Referencenumeral 13B indicates a filter element member having a color of B(blue). Here, in the present invention, a liquid drop can also be calledan “ink”.

When a predetermined amount of the filter element member 13 is filled ineach filter element forming areas 7, a solvent contained in the filterelement member 13 is evaporated by heating the motherboard 12 to nearly70□ by a heater. By this evaporation, as shown in FIG. 6C, volume of thefilter element member 13 decreases, and the filter element member 13becomes flat. If the volume of the filter element member 13 decreasesconspicuously, it is repeated that the liquid drop 8 of the filterelement member 13 is supplied and the liquid drop 8 is heated untilsufficient thickness is obtained for a color filter 1. By performing theabove-explained operations, a solid part of the filter element member 13remains and ultimately forms a substrate. By doing this, the filterelement 3 having each desired color is formed.

After the filter element 3 is formed by the above-explained operations,a predetermined period of heating operation is performed in apredetermined temperature so as to desiccate the filter elements 3completely. After that, a protecting layer 4 is formed by preferablemethods such as spin-coat method, roll-coat method, or ink-jet method.The protecting layer 4 is formed for protecting the filter element 3 andflattening a surface of the color filter 1. Here, in embodimentsaccording to the present invention, a non-translucent resin member forthe bulkhead 6 is used for a black matrix. However, translucent resinmember for the bulkhead 6 having a shading layer made of a metal such aschrome (Cr) beneath the translucent resin which is larger than thetranslucent resin is acceptable.

FIG. 8 shows an embodiment of the liquid drop ejecting apparatus forsupplying the filter element member 13 as shown in FIG. 6B. The liquiddrop ejecting apparatus 16 ejects one color member among R, G, and B,for example R as a liquid drop 8 of an ink onto a predetermined positionin each color filter forming areas 11 in the motherboard 12 shown inFIG. 5B and allows them to be fixed thereon. A liquid drop ejectingapparatus for a filter element member 13 for G (green) and a liquid dropejecting apparatus for a filter element member 13 for B (blue) areprepared respectively. Explanations for these structures are omittedbecause technical features of those structures are the same as shown inFIG. 8.

In FIG. 8, the liquid drop ejecting apparatus 16 comprises a head unit26 which is provided with an ink jet head 22 which is used in a liquiddrop ejecting head such as a printer, a head position controllingapparatus for controlling the position of the ink jet head 22, a baseboard position controlling apparatus 18 for controlling the position ofthe motherboard 12, a main scanning driving apparatus 19 for performinga main scanning movement of the ink jet head 22 to the motherboard 12, asub-scanning driving apparatus 21 for performing a sub-scanning movementof the ink jet head 22 to the motherboard 12, a base board supplyingapparatus 23 for supplying the motherboard 12 to a predeterminedposition in the liquid drop ejecting apparatus 16, and a controllingapparatus 24 for controlling the overall liquid drop ejecting apparatus16.

The main scanning driving apparatus 19 for performing the main scanningoperation of the head position controlling apparatus 17, a base boardposition controlling apparatus 18 and an ink jet head 22 to themotherboard 12 and a sub-scanning driving apparatus 21 are disposed on abase 9. Also, these apparatuses are covered by a cover 14 according tothe necessity.

For example, as shown in FIG. 10, the ink jet head 22 has a nozzle array28 containing a plurality of nozzles 27 in an array manner. The numberof the nozzles 27 is, for example, 180. Diameter of a hole of the nozzle27 is 28 μm. Nozzle pitch between the nozzles 27 is, for example, 141μm. In FIGS. 5A and 5B, a main scanning direction X to the color filter1 and the motherboard 12 and a sub-scanning direction Y which crossesorthogonally to the main scanning direction X are set as shown in FIG.10.

Position of the ink jet head 22 is set such that the nozzle array 28extends in a direction which crosses the main scanning direction X. Thefilter element member 13 is applied and is fixed onto the predeterminedposition in the motherboard 12 (see FIG. 5B) by ejecting the ink as afilter element member 13 from a plurality of nozzles 27 selectivelyduring the ink jet head 22 makes parallel movement in the main scanningdirection X. Also, the position of the main scanning operation by theink jet head 22 can be shifted with a predetermined interval by making aparallel movement of the ink jet head 22 in the sub-scanning direction Yby a predetermined interval.

The internal structure of the ink jet head 22 is shown, for example, inFIGS. 12A and 12B. More specifically, the ink jet head 22 comprises anozzle plate 29 made from a stainless-steel member, a vibrating plate 31which faces the nozzle plate 29, and a plurality of separating member 32which connects them. Between the nozzle plate 29 and the vibrating plate31, a plurality of ink chamber 33 and a liquid pool 34 are formed by theseparating members 32. A plurality of ink chambers 33 and the liquidpools 34 are connected via a path 38.

An ink supplying hole 36 is formed in an appropriate position of thevibrating plate 31. An ink supplying apparatus 37 is connected to theink supplying hole 36. The ink supplying apparatus 37 supplies one colorof filter element member M, for example R among R, G, and B to the inksupplying hole 36. The filter element member M which is supplied therefills the liquid pool 34, and then fills the ink chamber 33 by passingthrough the path 38.

A nozzle 27 which ejects the filter element member M from the inkchamber 33 in a jet manner is provided to the nozzle plate 29. An inkcompressing member 39 is disposed on a surface the vibrating plate 31.On the opposite surface of the vibrating plate 31, the ink chambers 33are formed. The ink compressing members 39 are formed so as tocorrespond to the ink chambers 33. As shown in FIG. 12B, the inkcompressing member 39 has a piezoelectric element 41 and a pair ofelectrodes 42 a and 42 b for sandwiching the piezoelectric element 41.The piezoelectric element 41 makes a deflective transformation so as toprotrude outside shown by an arrow C in the drawing by an electricconnection between the electrode 42 a and the electrode 42 b. By doingthis, the cubic capacity of the ink chamber 33 increases. Consequently,the filter element member M which corresponds to the increased volume ofthe ink chamber 33 passes through the path 38 from the liquid pool 34 soas to flow in the ink chamber 33.

Next, when the electric connection to the piezoelectric element 41 isdisconnected, the shape of the piezoelectric element 41 and thevibrating plate 31 recovers to an initial shape. By doing this, thecubic capacity of the ink chamber 33 is reset to the initial capacity.Thus, pressure of the filter element member M inside the ink chamber 33increases and the filter element member M is ejected from the nozzle 27to the motherboard 12 (see FIG. 5B) in a liquid drop condition. Here,around the nozzle 27, an ink-repellent layer 43 such asNi-tetrafluoroethylene eutectoid plating layer is formed for preventingflying drop of the liquid drop 8 and preventing the hole of the nozzle27 from being clogged.

In FIG. 9, a head position controlling apparatus 17 comprises an αmotorfor rotating the ink jet head 22, βmotor 46 for shaking and rotating theink jet head 22 around an axis which is parallel with the sub-scanningdirection Y, a γmotor 47 for shaking and rotating the ink jet head 22around an axis which is parallel with the main scanning direction X, anda Z motor 48 for making a parallel movement of the ink jet head 22vertically.

As shown in FIGS. 8 and 9, the base board position controlling apparatus18 comprises a table 49 for having a motherboard 12 thereon and a θmotor51 for performing an in-plane rotation of the table 49 as indicated byan arrow θ. Also, as shown in FIGS. 8 and 9, the main scanning drivingapparatus 19 comprises an X guide rail 52 which extends in the mainscanning direction X and an X slider 53 which contains a linear motorwhich is driven in a pulsed manner. The X slider 53 makes a parallelmovement in the main scanning direction X along the X guide rail 52 whena built-in linear motor is operated.

Also, as shown in FIGS. 8 and 9, the sub-scanning driving apparatus 21comprises a Y guide rail 54 which extends in the sub-scanning directionY and a Y slider 56 which contains a linear motor which is driven in apulse manner. The Y slider 56 moves in a parallel movement in thesub-scanning direction Y along the Y guide rail 54 when a built-inlinear motor is operated.

A linear motor which is driven in pulsed manner in the X slider 53 andthe Y slider 56 can control rotating angle of the output axis preciselyby a pulse signal which is supplied to the motors. Therefore, it ispossible to control a position of the ink jet head 22 which is supportedby the X slider 53 in the main scanning direction X and a position ofthe table 49 in the sub-scanning direction Y very precisely. Here, theposition of the ink jet head 22 and the table 49 can be controlled notonly by a controlling method which uses a pulse motor but also by afeed-back controlling method which uses a servo-motor or any kind ofcontrolling method.

A base board supplying apparatus 23 which is shown in FIG. 8 comprises abase board containing section 57 for containing the motherboard 12 and arobot 58 for transporting the motherboard 12. The robot 58 comprises abase stand 59 which is put on the base surface such as a floor and theground, a raising/lowering axis 61 on which the base stand 59 is raisedand lowered, a first arm 62 which rotates around the raising/loweringaxis 61, a second arm 63 which rotates on the first arm 62, and anadhesion pad 64 which is disposed beneath the tip of the second arm 63.The adhesion pad 64 can adhere the motherboard 12 by an absorbing methodsuch as an air-sucking method, or the like.

In FIG. 8, a capping apparatus 76 and a cleaning apparatus 77 aredisposed under a moving track of the ink jet head 22 which is driven bythe main scanning driving apparatus 19 so as to produce the mainscanning movement. This position is in either side of the sub-scanningdriving apparatus. On the other side, a electronic balance 78 isdisposed. The cleaning apparatus 77 cleans the ink jet head 22. Theelectronic balance measures the weight of the liquid drop of the inkwhich is ejected from the nozzle 27 (see FIG. 10) in the ink jet head 22according to each nozzle. In addition, the capping apparatus 76 preventsthe nozzle 27 (see FIG. 10) from being desiccated while the ink jet head22 is in a waiting condition.

A head camera 81 is disposed near the ink jet head 22 so as to moveuniformly with the ink jet head 22. Also, a base stand camera 28 whichis supported by a supporting device (not shown in the drawing) which isdisposed on the base 9 is disposed in a position from which the pictureof the motherboard 12 can be taken.

A controlling apparatus 24 which is shown in FIG. 8 comprises a computerunit 66 which contains a processor, a keyboard as an inputting interface67, and a CRT (cathode ray tube) display 68 as a display apparatus. Theabove-mentioned processor comprises a CPU (central processing unit) 69for performing a calculating operation and an information storing media71 such as a memory for storing various information as shown in FIG. 14.

The head position controlling apparatus 17, the base board positioncontrolling apparatus 18, the main scanning driving apparatus 19, thesub-scanning driving apparatus 21, and a head driving circuit 72 fordriving the piezoelectric element 41 (see FIG. 12B) in the ink jet head22 shown in FIG. 8 are connected to the CPU 69 via an input/outputinterface 73 and a bus 74 as shown in FIG. 14. Also, the base boardsupplying apparatus 23, an inputting apparatus 67, the CRT display 68,the electronic balance 78, the cleaning apparatus 77, and the cappingapparatus are connected to the CPU 69 via the input/output interface 73and the bus 74.

Memory such as an information storing medium 71 includes a semiconductormemory such as those of RAM (random access memory) and ROM (read onlymemory) and an external storing apparatus such as a hard disk drive,CD-ROM (compact disk read only memory) reading apparatus, and a diskstoring medium. In these memories, from a functional point of view, amemory area for storing a program which contains a controlling processof the movement of the liquid drop ejecting apparatus 16, a memory areafor storing a coordinate data for ejecting position of a color elementamong R, G, and B to the motherboard 12 (see FIG. 5) so as to realizeR-G-B disposition shown in FIGS. 7A to 7C, a memory area for storing anamount of the sub-scanning movement of the motherboard 12 in thesub-scanning direction Y in FIG. 9, an area which functions as a workarea of the CPU 69 or a temporary file, and various storing areas aredisposed.

The CPU 69 controls the ejection of the filter element member 13 such asink onto a predetermined position of a surface of the motherboard 12according to the program software which is stored in a memory as theinformation storing medium 71. More specifically, the CPU 69 has acleaning calculation section for performing calculations for realizingthe cleaning processing, a capping calculation section for realizing thecapping processing, a weight measurement calculating section forperforming calculations for realizing the weight measurement by usingthe electronic balance 78 (see FIG. 8), and a delineating calculatingsection for performing calculations for delineating the filter elementmember 13 by ejecting the liquid drop so as to realize functions of theCPU 69.

In detail, the delineating calculating section has various functionalcalculating sections such as a delineation starting position calculatingsection for setting the ink jet head 22 to an initial position fordelineation, a main scanning controlling calculating section forperforming calculation so as to control such that the ink jet head 22makes a scanning movement in the main scanning direction X at apredetermined speed, a sub-scanning control calculating section forperforming calculation so as to control the shift of the motherboard 12by a predetermined sub-scanning amount in the sub-scanning direction Y,and a nozzle ejection control calculating section for performingcalculation so as to control the ejection of the filter element membersuch as ink by determining which nozzle to operate among a plurality ofnozzles in the ink jet head 22.

Here, in embodiments of the present invention, the above-mentionedfunctions are realized by using the software program which is containedin the CPU 69. If such functions can be realized by a single electriccircuit which does not use the CPU 69, such an electric circuit can beused.

Hereinafter, operation of the liquid drop ejecting apparatus 16 havingthe above-mentioned structures is explained according to a flow chartshown in FIG. 15 as follows.

When the liquid drop ejecting apparatus 16 is started by turning poweron by an operator, an initial setting is executed in a step S1. Morespecifically, devices such as a head unit 26, a base board supplyingapparatus 23, and a control apparatus 24 are set to be in apredetermined initial setting condition.

Next, when the weight measurement timing comes (YES in step S2), thehead unit 26 in the FIG. 9 is moved (step S3) to the electronic balance78 shown in FIG. 8 by the main scanning driving apparatus 19. The amountof ink which is ejected from the nozzle 27 is measured by the electronicbalance 78 (step S4). Consequently, voltage which is charged to thepiezoelectric element 41 which corresponds to each nozzle 27 is adjustedaccording to the ink ejecting performance of the nozzle 27 (step S5).

After that, when the cleaning timing comes (YES in step S6), the headunit 26 is moved to the cleaning apparatus 77 by the main scanningdriving apparatus 19 (step S7). The ink jet head 22 is cleaned by thecleaning apparatus 77 (step S8).

If the weight measuring timing and the cleaning timing do not come (Noin steps S2 and S6), or when these processings are completed, the baseboard supplying apparatus 23 is operated so as to supply the motherboard12 to the table 49. More specifically, the motherboard 12 inside thebase board containing section 57 is held by the adhesion pad 64 so as tobe retained. Next, an raising/lowering axis 61, the first arm 61, andthe second arm 63 move so as to transport the motherboard 12 to thetable 49. Furthermore, the table 49 is pushed to a positioning pin 50(see FIG. 9) which is disposed in an appropriate position on the table49 in advance. Here, for a purpose of preventing the position shift ofthe motherboard 12 which is disposed on the table 49, it is preferablethat the motherboard 12 be fixed on the table 49 by using a device suchas an air-suction device.

Next, the motherboard 12 is observed by the base board camera 82 whichis shown in FIG. 8, and the output axis of the θ motor 51 shown in FIG.9 is rotated by a very fine angle unit. By doing this, in-plane rotationof the table 49 is performed in a very fine angle unit so as to positionthe motherboard 12 (step S10). After that, while the motherboard 12 isobserved by the head cameral 81 shown in FIG. 8, a starting position ofthe delineation by the ink jet head 22 is determined by a calculation(step S11). Consequently, the main scanning driving apparatus 19 and thesub-scanning driving apparatus 21 are appropriately operated so as tomove the ink jet head 22 to the delineation starting position (stepS12).

At this time, the nozzle array 28 of the ink jet head 22 is disposed soas to be diagonal to the sub-scanning direction Y of the ink jet head 22by an angle θ. In the case in which an ordinary liquid drop ejectingapparatus 16 is used, it is common for the pitch between the nozzles asan interval between the neighboring nozzles 27 and the element pitchwhich is an interval between the filter element forming areas 7 such asneighboring filter elements 3 to be different. This disposition is madeso as to equalize a dimensional component of the sub-scanning directionY between the pitch between nozzles and the element pitch geometricallywhen the ink jet head 22 is moved in the main scanning direction X.

In the step S12 shown in FIG. 15, when the ink jet head 22 is positionedin the delineation starting position, the ink jet head 22 is disposed ina position (a) shown in FIG. 1. After that, in step S13 shown in FIG.15, the main scanning operation in the main scanning direction X starts,and the ink ejection starts at the same time. More specifically, themain scanning driving apparatus 19 shown in FIG. 9 is operated and thescanning movement of the ink jet head 22 is performed in the mainscanning direction X shown in FIG. 1 in an uniform speed in a linearmanner. During the scanning movement, when the nozzle 27 whichcorresponds to the filter element forming areas 7 to which the ink issupposed to be supplied comes, the filter element member such as ink isejected from the nozzle 27.

Here, the ink ejection amount at this time is not an amount whichfulfills the overall cubic volume of the filter element forming areas 7.The ink ejection amount at this time is an amount which fulfills afraction of the cubic volume thereof. In the present embodiment, theamount is one-fourth of the overall cubic volume thereof. The each ofthe filter element forming areas 7 are not buried in one time of inkejection from the nozzle 27 as explained later. This is because theoverall cubic volume is buried by a plurality of multiple ejections. Inthe present embodiment, the overall cubic volume is buried by a fourejections.

When the main scanning for one line of the mother board 12 is finished(YES in step S14), the ink jet head 22 makes a reverse movement back tothe initial position (a) (step S15). Furthermore, the ink jet head 22 isdriven by the sub-scanning driving apparatus 21 so as to move in thesub-scanning direction Y by a predetermined sub-scanning amount δ (stepS16).

In embodiments according to the present invention, the CPU 69 divides aplurality of nozzle 27 which form the nozzle array 28 of the ink jethead 22 into a plurality of groups n in FIG. 1 conceptually. The presentembodiment is under condition that n=4, that is, the nozzle array 28having length L contains 180 nozzles 27 which are considered to bedivided into four groups. By doing this, one nozzle group is determinedto contain 45 (=180/4) nozzles 27 and its length is determined to be L/nsuch as L/4 in the present embodiment. The above-mentioned sub-scanningamount 6 is a length of the nozzle group having L/4 in the sub-scanningdirection, which can be represented by a formula such as (L/4) cos θ.

Therefore, after finishing the main scanning for one line and returns tothe initial position (a), the ink jet head 22 makes a parallel movementin the sub-scanning direction Y shown in FIG. 1 by a distance 6 so as tomove to a position (b). In FIG. 1, the position (a) and the position (b)are described so as to be slightly shifted in the main scanningdirection X. This is for the purpose of better understanding of theexplanation. Actually, the position (a) and the position (b) are thesame in the main scanning direction X.

The ink jet head 22 which made the sub-scanning movement to the position(b) performs the main scanning movement and the ink ejectionrepetitively in step S13. In this main scanning movement, a line in asecond row in the color filter forming area 11 on the motherboard 12receives the ink ejection by the top nozzle group. A first line receivesa second ink ejection by a second nozzle group.

After that, while the ink jet head 22 repeats the sub-scanning movementfrom a position (c) to a position (k), the ink jet head 22 repeats themain scanning movement and the ink ejection (steps S13 to S16). By doingthis, an ink fixing process for one array of the color filter formingarea 11 of the motherboard 12 is completed. In embodiments according tothe present invention, the sub-scanning amount 6 is determined bydividing the nozzle array 28 into 4 groups. Therefore, when the mainscanning and the sub-scanning for one array of the above-mentioned colorfilter element forming area 11 are completed, each filter elementforming area 7 receives one ink ejection by a nozzle group. In totaleach filter element forming area 7 receives ink ejection four times. Apredetermined amount of the filter element member such as ink issupplied to fulfill the overall cubic volume of the filter elementforming area.

By doing this, the ink ejection for one array of the color filterforming area 11 is completed, the ink jet head 22 is driven by thesub-scanning driving apparatus 21 so as to be transported to the initialposition in the next array of the color filter forming area 11 (stepS19). Consequently, the main scanning operation, the sub-scanningoperation, and the ink ejection are performed repeatedly to the colorfilter forming area 11 which is disposed in the present array so as toform the filter element in the filter element forming area 7 (steps S13to S16).

After that, when a filter element 3 having one color such as those of Ramong three colors or R, G, and B is formed in all of the color filterforming area 11 in the motherboard 12 (YES in step S18), the motherboard12 which is processed is extracted to the outside by the base boardsupplying apparatus 23 or other transporting apparatuses in step S20.Consequently, unless the operator gives a command for finishing theprocesses (NO in step S21), the process returns to the step S2 and inkabsorbing operation for a color such as those of R is repeated to themotherboard 12.

When the operator gives a command for finishing the processes (YES instep S21), the CPU 69 transports the ink jet head 22 to the cappingapparatus 76 as shown in FIG. 8. The capping apparatus 76 performs thecapping process to the ink jet head 22 (step S22).

By doing this, the patterning process for one color such as those of Ramong three colors such as those of R, G, and B which are contained inthe color filter 1 is completed. After that, the motherboard 12 istransported to the liquid drop ejecting apparatus 16 which uses thefilter element member such as G as a second color among two colors suchas G and B so as to perform the patterning process for G color.Furthermore, the motherboard 12 is transported to the liquid dropejecting apparatus 16 which uses the filter element member such as B asa third color among three colors such as those of R, G, and B finally soas to perform the patterning process for B color. By doing this, themotherboard 12 having a plurality of color filters 1 which has desirabledot disposition of R, G, and B such as the stripe disposition shown inFIG. 5A is produced. By cutting the motherboard 12 according to thecolor filter forming area 11, a plurality of the color filters 1 can beproduced.

Here, if the color filter 1 is used for a purpose of performing thecolor-display operation in the liquid crystal apparatus, more structuressuch as electrodes and oriented films are layered on a surface of thecolor filter 1. In such a case, if the motherboard 12 is cut into aplurality of the color filters 1 before forming the electrodes and theoriented films, it is difficult to form the electrodes and the like.Therefore, the motherboard 12 should not be cut before forming theelectrodes and the oriented films and the motherboard 12 should be cutafter finishing necessary processes such as forming the electrodes andthe oriented films.

As explained above, according to manufacturing method for a color filterand a manufacturing apparatus in embodiments of the present invention,it is not that each of filter elements 3 in the color filter shown inFIG. 5A is formed by performing the main scanning X of the ink jet head22 in one time. Each of filter element 3 in the color filter shown inFIG. 5A is formed by a predetermined thickness by performing multipleink ejection n times by a plurality of nozzles 27 which belong todifferent nozzle groups. In the present embodiment, the ink ejection isperformed 4 (four) times. By doing this, if the ink ejection amountdiffers among a plurality of the nozzles 27, it is possible to preventthe ink ejection amount from being different among a plurality of thefilter elements 3. Therefore, it is possible to equalize thetranslucency on a plane of the color filter 1.

In the present embodiment of the manufacturing method according to thepresent invention, the filter element 3 is formed by ejecting the inkusing the ink jet head 22. Therefore, certainly, it is not necessary toarrange a complicated manufacturing process such as photolithographymethod. Therefore, members and materials for manufacturing the filterelement can be reduced.

In the explanation of the FIG. 36A, it has been explained thatdistribution of the ink ejection amount from a plurality of nozzles 27which form the nozzle array 28 of the ink jet head 22 is not uniform.Also, it has been explained that the ink ejection amount which isejected from several pieces of nozzle 27 in the nozzle array 28 islarge. For example, 10 pieces of nozzle 27 which are disposed on bothend of the nozzle array respectively ejects more ink than the othernozzles. As explained above, it is not preferable that nozzles 27 whicheject more ink than the other nozzles 27 be used from a point of viewfor obtaining uniform thickness of the filter element 3 such as ejectedink.

Therefore, as shown in FIG. 13, it is preferable that several pieces ofnozzle 27 which are disposed on both ends section of the nozzle array 28for forming the nozzle array 28 are set not to eject ink in advance, anda plurality of nozzles 27 which exist on the rest of the nozzle array 28are divided into a plurality of groups such as 4 (four) groups so as toperform the sub-scanning movement according to the nozzle group unit.

In the present embodiment, a non-translucent resin member is used for abulkhead 6. It is certain that a translucent resin member can be usedfor a translucent bulkhead 6. In such a case, extra members such astranslucent metal films or resin members are disposed in positionscorresponding to the filter element 3 such as on the bulkhead 6 or underthe bulkhead 6 so as to dispose them as a black mask. Also, it isacceptable that the bulkhead 6 is formed by the translucent resin memberso as not to make it as a black mask.

Also, in the present embodiment, R, G, and B are used for the filterelement 3. It is certain that the filter element 3 is not limited to R,G, and B. For example, C (cyan), magenta (M), and yellow (Y) can beused. In such a case, the filter element member containing C, M, and Ycan be used instead of the filter element member containing R, G, and B.

Furthermore, in the present embodiment, the bulkhead 6 is formed by thephotolithography method. The bulkhead 6 can be formed by the ink jetmethod as well as the color filter 1.

(Explanation 2 for a Manufacturing Method for a Color Filter andApparatus Therefor).

FIG. 2 is a view for explaining a manufacturing method for a colorfilter according to the present invention which is explained above and amodified form of a manufacturing apparatus therefor. In FIG. 2, it isgraphically shown that the filter element member 13 such as an ink isejected to be supplied to each of the filter element forming areas 7 inthe color filter forming areas 11 in the motherboard 12 by using the inkjet head 22.

Processes which are performed in the present embodiment are generallythe same as the processes which are shown in FIG. 6. Also, the liquiddrop ejecting apparatus for ejecting ink is the same as the apparatusshown in FIG. 8 from a structural point of view. Also, the CPU 69 whichdivides a plurality of nozzles 27 for forming the nozzle array 28 as npieces of conceptual groups, for example, 4 groups, and make themcorrespond to the length of each of nozzle groups L/n or L/4 so as todetermine the sub-scanning amount is the same as the case which is shownin FIG. 1.

The present embodiment is different from the previous embodiment whichis shown in FIG. 1 in that a program software which is stored in amemory as an information storing media 71 in FIG. 14 is modified. Morespecifically, the main scanning controlling calculation and thesub-scanning controlling calculation which are performed by the CPU 69are modified.

More specifically, in FIG. 2, the ink jet head 22 is controlled suchthat the ink jet head 22 does not return to the initial position afterfinishing the scanning movement in the main scanning direction X, andthe ink jet head 22 moves over a moving amount of which is equivalent toone nozzle group in the sub-scanning direction to a position (b)immediately after finishing the main scanning movement in one direction,and after that, the ink jet head 22 performs the scanning movement in anopposite direction to the above one direction of the main scanningdirection X and returns to a position (b′) which is shifted by adistance in the sub-scanning direction from the initial position (a). Itis certain that the ink is selectively ejected from a plurality ofnozzles 27 during a main scanning period between the position (a) andthe position (b) and a main scanning period between the position (b) andthe position (b′).

That is, in the present embodiment, the main scanning operation and thesub-scanning operation of the ink jet head 22 are performed alternatelyand continuously without the returning operation. By doing this, a timenecessary for the returning operation can be omitted so as to shortenthe operating time.

(Explanation 3 for a Manufacturing Method for a Color Filter andApparatus Therefor).

FIG. 3 is a view for explaining a manufacturing method for a colorfilter according to the present invention which is explained above and amodified form of a manufacturing apparatus therefor. In FIG. 3, it isgraphically shown that the filter element member 13 such as an ink isejected to be supplied to each of the filter element forming areas 7 inthe color filter forming areas 11 in the motherboard 12 by using the inkjet head 22.

Processes which are performed in the present embodiment are generallythe same as the processes which are shown in FIG. 6. Also, the liquiddrop ejecting apparatus for ejecting ink is the same as the apparatusshown in FIG. 8 from a structural point of view. Also, the CPU 69 whichdivides a plurality of nozzles 27 for forming the nozzle array 28 into npieces of conceptual groups, for example, 4 groups and make themcorrespond to the length of each of nozzle groups L/n or L/4 so as todetermine the sub-scanning amount is the same as the case which is shownin FIG. 1.

The present embodiment is different from the previous embodiment shownin FIG. 1 in that an expanding direction of the nozzle 28 of the ink jethead 22 is parallel with the sub-scanning direction Y as shown in theposition (a) in FIG. 3 when the ink jet head 22 is set at thedelineation starting position on the motherboard 12 in a step S12 shownin FIG. 15. Such nozzle disposition is advantageous in a case in whichthe pitch between the nozzle of the ink jet head 22 and the pitchbetween the elements of the motherboard 12 are equal.

In the present embodiment, too, while the ink jet head 22 repeats thescanning movement in the main scanning direction X, the returningmovement to the initial position, and the sub-scanning movement in thesub-scanning direction Y over the moving amount from the initialposition (a) to the end position (k), the ink jet head 22 ejects thefilter element member such as ink from a plurality of nozzles 27selectively during a period of the main scanning movement. By doingthis, the filter element member is fixed in the filter element formingarea 7 in the color filter element forming area 11 of the motherboard12.

Here, in embodiments of the present invention, the nozzle array 28 isdisposed in parallel with the sub-scanning direction Y. By doing this,the sub-scanning movement amount is set to be equal to the length of thedivided nozzle group such as L/n, that is, L/4.

(Explanation 4 for a Manufacturing Method for a Color Filter andApparatus Therefor).

FIG. 4 is a view for explaining a manufacturing method for a colorfilter according to the present invention which is explained above and amodified form of a manufacturing apparatus therefor. In FIG. 4, it isgraphically shown that the filter element member 13 such as an ink isejected to be supplied to each of the filter element forming areas 7 inthe color filter forming areas 11 in the motherboard 12 by using the inkjet head 22.

Processes which are performed in the present embodiment are generallythe same as the processes which are shown in FIG. 6. Also, the liquiddrop ejecting apparatus for ejecting ink is the same as the apparatusshown in FIG. 8 from a structural point of view. Also, the CPU 69 whichdivides a plurality of nozzles 27 for forming the nozzle array 28 into nconceptual groups, for example, 4 groups and make them correspond to thelength of each of nozzle groups L/n or L/4 so as to determine thesub-scanning amount is the same as the case which is shown in FIG. 1.

The present embodiment is different from the previous embodiment shownin FIG. 1 in that an expanding direction of the nozzle 28 of the ink jethead 22 is parallel with the sub-scanning direction Y as shown in theposition (a) in FIG. 4 when the ink jet head 22 is set at thedelineation starting position on the motherboard 12 in a step S12 shownin FIG. 15, and the main scanning operation and the sub-scanningoperation of the ink jet head 22 are performed continuously andalternately without returning movement as well as the embodiment shownin FIG. 2.

Here, in the present embodiment shown in FIG. 4 and in the previousembodiment shown in FIG. 3, the main scanning direction X is orthogonalto the nozzle array 28. Therefore, by disposing two arrays of nozzlearray 28 along the main scanning direction X as shown in FIG. 11, it ispossible to supply the filter element member 13 to one filter elementforming area 7 by two nozzles 27 which are disposed on the same mainscanning line.

(Explanation 5 for a Manufacturing Method for a Color Filter andApparatus Therefor)

FIG. 16 is a view for explaining a manufacturing method for a colorfilter according to the present invention which is explained above and amodified form of a manufacturing apparatus therefor. FIG. 16 is showingan ink jet head 22A. The ink jet head 22A is different from the ink jethead 22 shown in FIG. 10 in that nozzle arrays containing three nozzlearrays such as the nozzle array 28R for ejecting an R color ink, thenozzle array 28G for ejecting a G color ink, and the nozzle array 28Bfor ejecting B color are formed in one unit such as an ink jet head 22A.The ink ejection system shown in FIGS. 12A and 12B are provided to eachof the three nozzle arrays. An R ink supplying apparatus 37R isconnected to the ink ejection system which corresponds to the R colornozzle array 28R. A G ink supplying apparatus 37G is connected to theink ejection system which corresponds to the G color nozzle array 28G. AB ink supplying apparatus 37B is connected to the ink ejection systemwhich corresponds to the B color nozzle array 28B.

Processes which are performed in the present embodiment are generallythe same as the processes which are shown in FIG. 6. Also, the liquiddrop ejecting apparatus for ejecting ink is the same as the apparatusshown in FIG. 8 from a structural point of view. Also, the CPU 69 whichdivides a plurality of nozzles 27 for forming the nozzle array 28 into npieces of conceptual groups, for example, 4 groups and make themcorrespond to the length of each of nozzle groups L/n or L/4 so as todetermine the sub-scanning amount is the same as the case which is shownin FIG. 1.

In the embodiment shown in FIG. 1, only one kind of nozzle array 28 isprovided to the ink jet head 22. Therefore, when a color filter 1 isformed by three colors such as those of R, G, and B, it is necessary toprepare the ink jet head 22 shown in FIG. 8 for each of three colorssuch as those of R, G, and B. In contrast, when the ink jet head 22Ashown in FIG. 16 is used, three colors such as those of R, G, and B canbe fixed onto the motherboard 12 simultaneously by just one mainscanning operation by the ink jet head 22A in the main scanningdirection X. Therefore, it is sufficient to prepare one ink jet head 22.Also, by synchronizing the interval between the nozzle arrays 28 of eachcolor to the pitch of the filter element forming area 7 of themotherboard 12, it is possible to eject three colors such as those of R,G, and B simultaneously.

(Explanation for Manufacturing Method for an Electrooptical ApparatusUsing Color Filter and a Manufacturing Apparatus Therefor)

FIG. 17 shows an embodiment of manufacturing method for a liquid crystalapparatus as an example of the electrooptical apparatus according to thepresent invention. Also, FIG. 18 shows an embodiment of a liquid crystalapparatus which is manufactured by the above-mentioned manufacturingmethod. Also, FIG. 19 is a cross section of the liquid crystal apparatusshown in FIG. 18 viewed along a line IV-IV. Before explainingmanufacturing method for a liquid crystal apparatus and a manufacturingapparatus therefor, an example of the liquid crystal apparatus which ismanufactured by the manufacturing method is explained. Here, the liquidcrystal apparatus according to the present embodiment is asemi-translucent reflecting liquid crystal apparatus in which thefull-color display operation is performed by a simple matrix method.

In FIG. 18, a liquid crystal apparatus 101 mounts a liquid crystaldriving IC (integrated circuit) 103 as a semiconductor chip and a liquidcrystal driving IC 103 b on a liquid crystal panel 102 and connects anFPC (Flexible Printed Circuit) 104 as a wiring connecting element to theliquid crystal panel 102. Furthermore, the liquid crystal apparatus 101is formed by providing a lighting apparatus 106 as a back light on aback surface of the liquid crystal panel 102.

The liquid crystal panel 102 is formed by attaching a first base board107 a and a second base board 107 b by a sealing member 108. The sealingmember 108 is formed by fixing an epoxy resin on an inner surface of thefirst base board 107 a or the second base member 107 b in a circularmanner, for example, by screen printing method. Also, a conductingmember 109 which is made from a conductive member formed spherically orcylindrically is contained in the sealing member 108 in a dispersedmanner as shown in FIG. 19.

In FIG. 19, the first base board 107 a has a planar base member 111 awhich is made from a translucent glass or a translucent plastic member.In an inner surface of the base member 111 a (a top surface in FIG. 19),a reflecting layer is formed. An insulating layer 113 is layeredthereon, and a first electrode 114 a is formed thereon in a stripedmanner (see FIG. 18) viewed in an arrow direction D. Furthermore, anoriented film 116 a is formed thereon. Also, on an outer surface (bottomsurface in FIG. 19) of the base member 111 a, a polarizing plate 117 ais attached by an adhesion method or the like.

In FIG. 18, intervals between stripes are shown larger than theyactually are for the purpose of better understanding the arrayarrangement of the first electrode 114 a. Therefore, fewer firstelectrodes 114 a are shown than the actual number of the first electrode114 a. However, more number of the first electrodes 114 a are disposedon the base member 111 a than appears in the drawing.

In FIG. 19, the second base board 107 b has a planar base member 111 bwhich is made from a translucent glass or a translucent plastic member.In an inner surface of the base member 111 b (a bottom surface in FIG.19), a color filter 118 is formed. A second electrode 114 b is formed ina direction orthogonal to the first electrode 114 a in a striped manner(see FIG. 18) viewed in an arrow direction D. Furthermore, an orientedfilm 116 b is formed thereon. Also, on an outer surface (top surface inFIG. 19) of the base member 111 b, a polarizing plate 117 b is attachedby an adhesion method or the like.

In FIG. 18, intervals between stripes are shown larger than theyactually are for the purpose of better understanding the arrayarrangement of the second electrode 114 b as well as the first electrode114 a. Therefore, fewer second electrodes 114 b are shown than theactual number of the second electrodes 114 b. However, more of thesecond electrodes 114 b are disposed on the base member 111 b thanappears in the drawing.

In FIG. 19, in a space such as a cell gap which is surrounded by thefirst base board 107 a, the second base board 107 b, and the sealingmember 108, a liquid crystal L such as STN (Super Twisted Nematic)liquid crystal is sealed. On an inner surface of the first base board107 a or the second base board 107 b, numerous fine spherical spacers119 are dispersed. By disposing the spacers 119 in the cell gap, thethickness of the cell gap is maintained in uniform thickness.

The first electrode 114 a and the second electrode 114 b are disposed inan orthogonal manner. The crossing point of the above-mentionedelectrodes is disposed in a dot-matrix manner viewed in an arrowdirection D shown in FIG. 19. Each of the crossing points in dot matrixmanner is one picture element pixel. The color filter 118 is formed bydisposing each of the color elements such as those of R (red), G(green), and B (blue) in a predetermined pattern viewed from an arrowdirection D such as striped disposition, delta disposition, and mosaicdisposition. One picture element pixel corresponds to each color such asthose of R, G, and B. Picture element pixels containing three colorssuch as those of R, G, and B is one unit so as to form one pixel.

By illuminating a plurality of picture element pixel such as pixelswhich are disposed in dot matrix manner selectively, images such as aletter and numerals are displayed on outside of the second base board107 b of the liquid crystal panel 102. Such an area in which the imagesare displayed is an effective pixel area. A planar rectangle area whichis indicated by an arrow V in FIGS. 18 and 19 is the effective displayarea.

In FIG. 19, the reflecting film 112 is formed by an optical reflectingmember such as APC alloy (Silver-Palladium-Copper alloy) or Al(aluminum). An opening section 121 is formed in a position whichcorresponds to each picture element pixel which is a crossing point ofthe first electrode 114 a and the second electrode 114 b. As a result,the opening section 121 is disposed in a dot matrix manner as well asthe picture element pixel when viewed in an arrow direction D shown inFIG. 19.

The first electrode 114 a and the second electrode 114 b are formed by,for example, a translucent conductive member such as an ITO (Indium-TinOxide). Also, the oriented film 116 a and 116 b are formed by applying apolyimide group resin in a uniform thickness film. By rubbing theoriented films 116 a and 116 b, an initial disposition of the liquidcrystal molecules on a surfaces of the first base board 107 a and thesecond base board 107 b are determined.

In FIG. 18, the first base board 107 a is formed so as to be larger thanthe second base board 107 b. When these base boards are attached by thesealing member 108, the first base board 107 a has a base boardexpanding section 107 c which expands to outside of the second baseboard 107 b. Consequently, on the base board expanding section 107 c,various wiring members such as an extended wiring 114 c which extendsfrom the first electrode 114 a, an extended wiring 114 d which conductsthe second electrode 114 b on the second base board 107 b via anconductive member 109 (see FIG. 19) which exists inside the sealingmember 108, a metal wiring 114 e which is connected to an input bumpsuch as an input terminal of the liquid crystal driving IC 103 a, and ametal wire 114 f which is connected to an input bump of the liquidcrystal driving IC 103 b are formed in appropriate patterns.

In embodiments according to the present invention, the extended wiring114 c which extends from the first electrode 114 a and the extendedwiring 114 d which leads to the second electrode 114 b are formed by anITO which is made from the same member as the electrodes such as aconducting oxide. Also, the metal wirings 114 e and 114 f which arewirings for inputting ends of the liquid crystal ICs 103 a and 103 b aremade from a low electric resistance metal member such as an APC alloy.The APC alloy contains mainly Ag in addition to alloy containing Pd andCu such as an alloy containing 98% of Ag, 1% of Pd, and 1% of Cu.

The liquid crystal driving ICs 103 a and 103 b are adhered on a surfaceof the extended base board section 107 c by an ACF (AnisotropicConductive Film) 122 so as to be mounted thereon. That is, in thepresent embodiment, the liquid crystal panel is formed as a COG (chip onglass) liquid crystal display in which semiconductor chips are mountedon the base board directly. In the mounting structure of the COG method,the inputting bumps of the liquid crystal driving ICs 103 a and 103 band the metal wirings 114 e and 114 f are connected conductively byconductive grains which are contained inside the ACF 122. Also, theoutputting bumps of the liquid crystal driving ICs 103 a and 103 b andthe extended wirings 114 c and 114 d are conductively connected.

In FIG. 18, the FPC 104 comprises a flexible resin film 123, a circuit126 containing a chip member 124, and a metal wiring terminal 127. Thecircuit 126 is mounted on a surface of the resin film 123 directly by aconductive connecting method such as a soldering method or the like.Also, the metal wiring terminal 127 is formed by a conductive membersuch as an APC alloy, Cr, Cu, or the like. A portion of the FPC 104 inwhich the metal wiring terminal 127 is formed is connected to a portionof the first base board 107 a in which the metal wirings 114 e and 114 fare formed by the ACF 122.

In a peripheral area which is opposite to the FPC 104, an externalconnecting terminal 131 is formed. The external connecting terminal 131is connected to an external circuit which is not shown in the drawing.The liquid crystal driving ICs 103 a and 103 b are driven by signalswhich are transmitted from the external circuit. The scanning signal issupplied to either one of the first electrode 114 a or the secondelectrode 114 b, and the data signal is supplied to the other one of theabove-mentioned electrodes. By doing this, voltage of each of thepicture element pixels in dot matrix manner which are disposed insidethe effective displaying area V are controlled. As a result, theorientation of the liquid crystal L is controlled according to eachpicture element pixel.

In FIG. 18, a lighting apparatus 106 which works as a backlightcomprises a light introducing member 132 which is made from an acrylicresin, a dispersing sheet 133 which is provided on a light emittingsurface 132 b of the light introducing member 132, a reflecting sheet134 which is provided on an opposite surface of the light emittingsurface 132 b of the light introducing member 132, and an LED (lightemitting diode) as a illuminating source as shown in FIG. 19.

The LED 136 is supported by an LED base board 137. The LED base board137 is mounted on the supporting member (not shown in the drawing) whichis formed integrally with, for example, the light introducing member132. By disposing the LED base board 137 in a predetermined position inthe supporting member, the LED 136 is disposed in a position which facesa light collecting surface 132 a which is a vertical surface of thelight introducing member 132. Here, reference numeral 138 indicates abuffering member for buffering impacts which are given to the liquidcrystal panel 102.

When the LED 136 illuminates, the light is collected by the lightcollecting surface 132 a so as to be introduced inside the lightintroducing member 132. Consequently, the light is emitted to theoutside from the light emitting surface 132 b via the dispersing sheet133 while the light is reflected by a wall surface of the reflectingsheet 134 and the light introducing member 132.

The liquid crystal apparatus 101 according to the present embodiment ismade as explained above. When external light such as sunlight or roomlight is sufficiently bright, in FIG. 19, the external light iscollected inside the liquid crystal panel 102 via the second base board107 b. After the light passes the liquid crystal L, the light isreflected by the reflecting film 112 so as to be supplied to the liquidcrystal L again. The orientation of the liquid crystal L is controlledby electrodes 114 a and 114 b which sandwich the liquid crystal Laccording to picture element pixels such as those of R, G, and B.Accordingly, the light which is supplied to the liquid crystal L ismodulated according to each of the picture element pixels; and thus, bythe modulation, images such as a letter and a numeral are displayed onan external surface of the liquid crystal panel 102 by combination ofthe light which is transmitted through the polarizing plate 117 b andthe light which does not transmit therethrough.

On the other hand, when the external light is not collectedsufficiently, the LED 136 illuminates so as to emit a plane light fromthe light emitting surface 132 b of the light introducing member 132.The light is supplied to the liquid crystal L via the opening section121 which is formed on the reflecting film 112. At this time, similarlyto the a case of the display operation according to the reflectingmethod, the supplied light is modulated by the liquid crystal L in whichthe orientation is controlled according to the picture element pixel. Bydoing this, the images are displayed toward the outside; thus, thedisplay operation according to the transmitting method is performed.

The liquid crystal apparatus 101 having the above-explained structure ismanufactured according to manufacturing method shown in, for example,FIG. 17. In the manufacturing method, the first base board 107 a ismanufactured by a series of process P1 to P6. The second base board 107b is manufactured by a series of process P11 to P14. It is common forthe processes for manufacturing the first base board and the processesfor manufacturing the second base board to be performed independently.

The processes for manufacturing the first base board is explained asfollows. The reflecting film which corresponds to a plurality of liquidpanel 102 is formed on a surface of a large area motherboard materialwhich is made from the translucent glass member or translucent plasticmember according to photolithography methods or the like. Furthermore,the insulating layer 113 is formed thereon by using common film formingmethod (process P1). Next, the first electrode 114 a, the extendedwirings 114 c and 114 d, the metal wirings 114 e and 114 f are formed byusing the photolithography method or the like (process P2).

After that, the oriented film 116 a is formed on the first electrode 114a by an applying method or a printing method (process P3). Furthermore,an initial orientation of the liquid crystal is determined by performinga rubbing operation on the oriented film 116 a (process P4). Next, thesealing member 108 is formed in a circular manner by a screen printingmethod or the like (process P5). Furthermore, a spherical spacer 119 isdispersed thereon (process P6). By doing this, a large area firstmotherboard having a plurality of panel patterns of the first base board107 a of the liquid panel 102 is formed.

Apart from the above-explained processes for manufacturing the firstbase board, the processes for manufacturing the second base board areperformed (processes P11 to P14 in FIG. 17). First, a large areamotherboard material member which is made from a translucent glassmember or a translucent plastic member is prepared. A color filter 118which is equal to a plurality of the liquid crystal panels 102 is formedon a surface of the motherboard material member (process P111).Processes for forming the color filter 118 are shown in themanufacturing method shown in FIG. 6. Each color filter element such asthose of R, G, and B in the manufacturing method is made by using theliquid drop ejecting apparatus 16 shown in FIG. 8 according to acontrolling method for the ink jet head 22 as shown in FIGS. 1 to 4.Technical features of the manufacturing method for the color filter andthe controlling method for the ink jet head 22 are the same as thosedescribed previously in the specification; therefore, explanation isomitted.

As shown in FIG. 6D, when a color filter 1 such as a color filter 118 isformed on the motherboard 12 such as the motherboard material member,the second electrode 114 b is subsequently formed thereon consequentlyby a photolithography method (process P12). Furthermore, the orientedfilm 116 b is formed by an applying method or a printing method (processP13). Next, rubbing process is performed on the oriented film 116 b;thus, the initial orientation of the liquid crystal is determined(process P14). By doing this, a large area second motherboard having aplurality of panel patterns of the liquid crystal panel 102 on thesecond base board 107 b is formed.

As explained above, after a large area first motherboard and a largearea second motherboard are formed, these motherboards are sandwichedbetween the sealing members 108. Furthermore, after the positions ofthese boards are aligned, these motherboards are attached (process P21). By doing this, an empty panel containing a panel member in whichthe liquid crystal which is equal to a plurality of the liquid crystalsis contained and no liquid crystal is poured thereinto is formed.

Next, a scribed groove as a cutting groove is formed in a predeterminedposition on the finished empty panel structure member. Furthermore, thepanel structure member is cut by the scribed groove as a cuttingreference (process P22). By doing this, an empty panel structure memberwith a slit in which the liquid crystal pouring mouth 110 (see FIG. 18)of the sealing member 108 on each liquid crystal panel is exposed to theoutside is formed.

After that, the liquid crystal L is poured inside each of the liquidcrystal panel via the exposed liquid crystal pouring mouth 110.Furthermore, each liquid crystal pouring mouth 110 is sealed by resin orthe like (process P23). In an ordinary liquid crystal pouring process,for example, a liquid crystal is stored in a storing container. Thestoring container in which the liquid crystal is stored and the emptypanel with a slit condition are contained in a chamber or the like. Airis evacuated from the chamber, and the empty panel with a slit is dippedinto the liquid crystal in the chamber. After that, the liquid crystalis poured when the chamber is opened to an atmospheric pressure. At thistime, the inside of the empty panel is under a vacuum condition.Therefore, the liquid crystal is compressed by the atmospheric pressure,and the liquid crystal is introduced into the panel through the liquidcrystal pouring mouth. After pouring the liquid crystal, the liquidcrystal sticks around the liquid crystal structure member. Therefore,the panel with a slit is cleaned in a process P24 after the liquidcrystal pouring process.

After the liquid crystal pouring process and the cleaning process, thescribed groove is formed in a predetermined position of the mother panelwith a slit. Furthermore, the panel with a slit is cut by the scribedgroove as a cutting reference point. By doing this, a plurality ofindependent liquid crystal panels 102 are cut into pieces (process P25).As shown in FIG. 18, the liquid crystal driving ICs 103 a and 103 b aremounted to each of independent liquid crystal panels 102 which ismanufactured in the above-explained processes, and the lightingapparatus 106 as a back light is mounted to the liquid crystal panel102. Furthermore, by connecting the FPC 104 to the liquid crystal panels102, the liquid crystal apparatus 101 as a final product is completed(process P26).

Manufacturing method for the liquid crystal apparatus explained aboveand the manufacturing apparatus therefor have the followingcharacteristics, particularly in the manufacturing steps for the colorfilter 1. That is, the color filter 1 shown in FIG. 5A such asindependent filter element 3 in the color filter 118 shown in FIG. 19 isnot formed at one time of main scanning X of the ink jet head 22 (seeFIG. 1). The ink is ejected to each of independent filter elements 3multiple times n such as, for example 4 (four) by a plurality of nozzles27 which belong to different groups. By doing this, the filter element 3is formed in a predetermined thickness. Therefore, if ink ejectionamount differs among a plurality of nozzles 27, it is possible toprevent different thicknesses of the plurality of filter elements 3.Therefore, it is possible to maintain the planar translucency of thecolor filter 1 uniformly. This means that clear color display operationwithout non-uniform color shifting is possible in the liquid crystalapparatus 101 shown in FIG. 19.

Also, in a manufacturing method for the liquid crystal apparatusexplained above and the manufacturing apparatus therefor according tothe present embodiment, the filter element 3 is formed by ejecting theink by using the ink jet head 22 by using the liquid drop ejectingapparatus 16 as shown in FIG. 8. Therefore, a complicated manufacturingprocess such as photolithography is not necessary, and the materialmember which is used for manufacturing the filter element is not wasted.

(Explanation for Manufacturing Method for an Electrooptical ApparatusUsing an EL Element and a Manufacturing Apparatus Therefor)

FIG. 20 shows an embodiment of a manufacturing method for an ELapparatus as an example for an electrooptical apparatus according to thepresent invention. Also, FIGS. 21A to 21D show important parts of themanufacturing process for an EL apparatus and a main part of a crosssection of the EL apparatus as a final product. As shown in FIG. 21D, anEL apparatus 201 forms an pixel electrode 202 on a transparent baseboard 204. Also, the EL apparatus 201 forms a bank 205 between the pixelelectrodes 202 in a grid manner viewed in an arrow direction G in thedrawing.

A positive hole ejection layer 220 is formed in a grid concave section.An R color illuminating layer 203R, a G color illuminating layer 203G,and a B color illuminating layer 203B are formed in each of the gridconcave sections in a predetermined array disposition such as stripedispositions viewed in an arrow direction G in the drawing. Furthermore,by forming a facing electrode 213 thereon, an EL apparatus 201 isformed.

When the pixel electrode 202 is driven by an active element having twoterminals such as TFD (Thin Film Diode), the above-mentioned facingelectrode 213 is formed in a stripe manner viewed in an arrow directionG. Also, the pixel electrode 202 is driven by an active element havingthree terminals such as TFT (Thin Film Transistor), the above-mentionedfacing electrode 213 is formed in a simple surface form.

A region which is sandwiched between the pixel electrode 202 and thefacing electrode 213 becomes one picture element pixel. The three colorpicture element pixels forms one unit so as to form one pixel. Bycontrolling an electric current which flows in the picture pixel, adesirable one of a plurality of picture element pixel is illuminatedselectively. By doing this, it is possible to display a desirablefull-color image viewed in an arrow direction H.

The above-mentioned EL apparatus 201 is manufactured by a manufacturingmethod shown in, for example, FIG. 20. That is, active elements such asa TFD element or a TFT element are formed on a surface of thetransparent base board 204 as shown in a process P 51 and FIG. 21A.Furthermore, a pixel electrode 202 is formed thereon. Here, as a formingmethod, for example, photolithography method, vacuum evaporation method,sputtering method, or a pyrosol method can be used. As a raw materialfor the pixel electrode 202, ITO (Indium-Tin Oxide), tin oxide,composite oxide of indium oxide, and zinc oxide can be used.

Next, as shown in a process P 52 and FIG. 21A, a bulkhead such as a bank205 is formed by using a common patterning method such as aphotolithography method. Spaces between the transparent pixel electrodes202 are buried by the bank 205. By doing this, contrast improves, mixingof the color illuminating members is prevented, and light leakage frombetween pixels can be prevented. For a raw material for a bank 205,there is no problem as long as the raw material is durable to solventsfor dissolving the EL illuminating member. It is preferable that afluorocarbon polymer coating be formed on a surface of the raw materialfor a bank 205 by performing a fluorocarbon plasma processing. For sucha material, an organic component such as acrylic resin, epoxy resin, andphotosensitive polyimide may be mentioned.

Next, just before applying a positive hole pouring ink as a functionalliquid material, a continuous plasma processing of the oxygen gas andthe fluorocarbon plasma is performed to the transparent base board 204(process P53). By doing this, a surface of polyimide becomeswater-repellant. A surface of the ITO becomes hydrophilic. Thus,wettablity of a base board for performing a patterning of the liquiddrop can be finely controlled. For a plasma generating apparatus, anapparatus which can generate plasma under vacuum conditions, and anapparatus which can generate plasma under atmospheric pressureconditions can be used similarly.

Next, as shown in process P54 and FIG. 21A, a positive hole pouring inkis ejected from an ink jet head 22 of the liquid drop ejecting apparatus16 shown in FIG. 8 so as to apply a patterning on a surface of the pixelelectrode 202. Specifically, in order to control the ink jet head 22,any one among controlling methods shown in FIGS. 1, 2, 3, and 4 may beused. After applying the patterning, a solvent is removed underconditions of a vacuum (1 torr), at room temperature, for 20 minutes(process P55). After that, by performing a heating process underconditions of atmospheric pressure, 20□ (on a hot plate), 10 minutes, apositive hole pouring layer 220 which is not soluble with theilluminating layer ink is formed (process P56). Under theabove-mentioned conditions, the thickness of the layer was 40 nm.

Next, as shown in a process P57 and FIG. 21B, the R illuminating layerink as an EL illuminating member as a functional liquid material and a Gilluminating layer ink as an EL illuminating member as a functionalliquid material are applied on the positive hole pouring layer 220 ineach of the filter element forming areas 7 by using a liquid dropejecting method. Here, each of the illuminating layer inks are ejectedfrom the ink jet head 22 of the liquid drop ejecting apparatus 16 shownin FIG. 8. For a controlling method for the ink jet head 22, any one ofthe methods shown in FIGS. 1 to 4 is used. By using the ink jet method,it is possible to perform a fine patterning operation easily andquickly. Also, by changing the a density of solid parts of ingredientsin the ink and the ejection amount, it is possible to change thethickness.

After applying the illuminating layer ink, the solvent is removed undercondition of, for example, a vacuum (1 torr), at room temperature, for20 minutes (process P58). Consequently, by performing a conjugatingoperation by the heating process under condition of, for example, anitrogen atmosphere, at 150□, for 4 hours, the R color illuminatinglayer 203R and the G color illuminating layer 203G are formed (processP59). Under the above-mentioned conditions, the thickness of the layerwas 50 nm. The illuminating layer which was conjugated by the heatingprocess is not soluble in the solvent.

Here, it is acceptable that a continuous plasma processing of the oxygengas and the fluorocarbon gas plasma be performed to the positive holepouring layer 220 before forming the illuminating layer. By doing this,a fluorocarbon polymer coating can be formed on the positive holepouring layer 220. Therefore, an ionizing potential increases. Becauseof this, the positive hole pouring efficiency increases. Thus, it ispossible to provide an organic EL apparatus having high illuminatingefficiency.

Next, as shown in a process P60 and FIG. 21C, the B color illuminatinglayer 203 as the EL illuminating member as a functional liquid materialis formed on the R color illuminating layer 203R, the G colorilluminating layer 203G, and the positive hole pouring layer 220 in eachpicture element pixel. By doing this, it is possible not only to formthree primary colors such as those of R, G, and B, but also to bury gapsamong the R color illuminating layer 203R, the G color illuminatinglayer 203G, and the bank 205 so as to flatten them. By doing this, it ispossible to prevent a short-circuit between electrodes which aredisposed vertically. By adjusting the thickness of the B colorilluminating layer 203B, the B color illuminating layer 203B works as anelectron pouring transporting layer in a layered structure of the Rcolor illuminating layer 203R and the G color illuminating layer 203G;thus, the B color illuminating layer 203B does not illuminate in Blue.

For a forming method for the B color illuminating layer 203B asexplained above, for example, a common spin-coating method can be usedas a wet method. Otherwise, an ink jet method which is equivalent to aforming method for the R color illuminating layer 203R and the G colorilluminating layer 203G can be used.

After that, as shown in a process P61 and FIG. 21D, a desired ELapparatus 201 is manufactured by forming a facing electrode 213. If thefacing electrode 213 is in a form of a surface electrode, the facingelectrode 213 can be formed by a film forming method such as a vacuumevaporation method, or sputtering method using material members such asMg, Ag, Al, and Li or the like. Also, if the facing electrode 213 is inthe form of a stripe electrode, the coated electrode layer can be formedby a patterning method such as a photolithography method vacuumevaporation method, or sputtering method using material members such asMg, Ag, Al, and Li or the like.

In the manufacturing method for the EL apparatus 201 and themanufacturing apparatus therefor as explained above, any one of thecontrolling methods shown in FIGS. 1 to 4 is used as the controllingmethod for the ink jet head. Therefore, the positive hole pouring layer220, the R color illuminating layer 203R, the G color illuminating layer203G, and the B color illuminating layer 203B in each picture elementpixel in FIGS. 21A to 21D are formed not by one time of the mainscanning operation X of the ink jet head (see FIG. 1), but by receivingthe ink ejection multiple times (n times, for example, 4 times) by thepositive hole pouring layer in a piece of the picture element pixeland/or each color illuminating layer of a plurality of nozzles 27 whichbelong to different nozzle groups in a predetermined thickness. By doingthis, the ink ejection amount differs among a plurality of nozzles 27,and it is possible to avoid that the thickness of the color illuminatinglayers differing among a plurality of the picture element pixels.Therefore, it is possible to equalize planar illumination distributioncharacteristics of the illuminating surface of the EL apparatus 201.This means that clear color-display operation without uneven colorcontrast can be realized in the EL apparatus shown in FIG. 21D.

Also, in the manufacturing method for the EL apparatus and themanufacturing apparatus according to the present embodiment, by usingthe liquid drop ejecting apparatus 16 as shown in FIG. 8, each of thecolor picture element pixels such as those of R, G, and B are formed byejecting the ink by the ink jet head 22. Therefore, complicatedmanufacturing method such as photolithography method is not necessary.Also, the material member which is used for manufacturing the filterelement is not wasted.

(An Embodiment of a Manufacturing Method for a Color Filter and aManufacturing Apparatus Therefor)

Next, an embodiment of a manufacturing apparatus for a color filteraccording to the present invention is explained with reference to thedrawings as follows. First, before explaining the manufacturingapparatus for a color filter, the color filter which is supposed to bemanufactured is explained. FIGS. 33A and 33B are enlarged views of acolor filter. FIG. 33A is a plan view. FIG. 33B is a cross sectionviewed along a line X-X shown in FIG. 33A. Here, in the color filtershown in FIGS. 33A and 33B, the structural members which are the same asthose of the color filter 1 shown in FIG. 5 are explained with the samereference numerals.

(Structure of the Color Filter)

In FIG. 33A, the color filter 1 is provided with a plurality of pixels1A which are disposed in matrix manner. These pixels 1A are separated bybulkhead 6 as a border. To each one of the pixels 1A, the color filtermember as a liquid material which is any one of inks such as those of R(red), G (green), or B (blue) such as filter element member 13 areintroduced. Disposition of the colors such as those of R, G, and B hasbeen explained to be, for example, a mosaic disposition. Also, asexplained above, any disposition such as a stripe disposition or a deltadisposition can be applied. The color filter 33 is shown in FIGS. 33Aand 33B.

The color filter 1 is provided with a translucent base board 12 and atranslucent bulkhead 6 as shown in FIG. 33B. A region where the bulkhead6 is not formed, that is, a removed area, is the above-explained pixel1A. The filter element 13 for each color which is introduced to thepixel 1A becomes a filter element 3 which is supposed to be a coloringlayer. On surfaces of the bulkhead 6 and the filter element 3, aprotecting coating 4 and an electrode layer 5 are formed as a protectinglayer.

(Structure of a Manufacturing Apparatus for Color Filter)

Next, a structure for a manufacturing apparatus for the above-mentionedcolor filter is explained with reference to the drawings as follows.FIG. 22 is a perspective view showing a liquid drop ejecting apparatusin a manufacturing apparatus for a color filter according to the presentinvention.

The manufacturing apparatus for color filters manufactures a colorfilter which is contained in the color liquid crystal panel as anelectrooptical apparatus. The manufacturing apparatus for color filtersis provided with a liquid drop ejecting apparatus which is not shown inthe drawing.

(Structure of Liquid Drop Ejecting Apparatus)

The liquid drop ejecting apparatus has 3 sets of liquid drop ejectingprocessing apparatuses 405R. 405G, and 405B as shown in FIG. 22,similarly to the case of the liquid drop ejecting apparatus of which anembodiment is explained above. These liquid drop ejecting processingapparatuses 405R, 405G, and 405B correspond to 3 colors such as those ofR, G, and B which are ejected to the motherboard 12 as filter elementmembers such as those of R, G, and B as color filter members as a liquidink. Here, the liquid drop ejecting processing apparatus 405R, 405G, and405B are disposed nearly in a series so as to form the liquid dropejecting apparatus. Also, to the liquid drop ejecting processingapparatus 405R, 405G, and 405B, a controlling apparatus for controllinga movement of each structural member is provided integrally.

Here, to the liquid drop ejecting processing apparatus 405R, 405G, and405B, transporting robots, which are not shown in the drawings, forbringing in and out a piece of motherboard 12 to the liquid dropejecting processing apparatus 405R, 405G, and 405B are connectedrespectively. Also, to the liquid drop ejecting processing apparatus405R, 405G, and 405B, for example, 6 pieces of motherboard 12 can becontained. Also, to the liquid drop ejecting processing apparatus 405R,405G, and 405B, a multi-stage baking furnace, which is not shown in thedrawings, is connected for desiccating the filter element member 13which is ejected after the motherboard 12 is heated under conditions of,for example, 120□, for 5 minutes.

In addition, each of the liquid drop ejecting processing apparatuses405R, 405G, and 405B has a thermal clean chamber 422 as a hollow casingas shown in FIG. 22. The temperature inside the thermal clean chamber422 is adjusted to, for example, 20±0.5□ so as to realize better andstable dotting in the ink jet method and so as to prevent dust fromentering from thereoutside. In the thermal clean chamber 322, a liquiddrop ejecting processing apparatus 423 is provided.

The liquid drop ejecting processing apparatus 423 has an X-axis airslide table 424 as shown in FIG. 22. On the X-axis air slide table 424,a main scanning driving unit 425 having a linear motor, not shown in thedrawings thereon is disposed. The main scanning driving apparatus 425has a base stand section, not shown in the drawings for fixing themotherboard 12 by, for example, absorbing method and moves the basestand section in the main scanning direction against the motherboard 12which is disposed in an X-axis direction.

In the liquid drop ejecting processing apparatus 423, as shown in FIG.22, a sub-scanning driving apparatus 427 which is located above theX-axis air slide table 24 as a Y-axis table is disposed. Thesub-scanning driving apparatus 427 moves the head unit 420 for ejectingthe filter element member 13 in, for example, a vertical direction inthe sub-scanning direction against the motherboard 12 which is disposedin Y-axis direction. Here, in FIG. 22, the head unit 420 is described bya continuous line as if it floats thereinside for better understandingof the positioning relationship between the head unit 420 and themotherboard 12.

Also, in the liquid drop ejecting processing apparatus 423, variouscameras not shown in the drawing as a position acknowledging member foracknowledging the position of the ink jet head 421 and the motherboard12 so as to control them are disposed. Here, the position of the headunit 420 and the base stand section can be controlled not only by aposition controlling method using a pulse motor but also by a feedbackcontrolling method using a servo-motor and any desirable controllingmethods.

Also, in the liquid drop ejecting processing apparatus 423, as shown inFIG. 22, a wiping unit 481 for wiping a surface from which the filterelement member 13 is ejected in the head unit 420 is disposed. Thewiping unit 481 is formed by winding up an end of a wiping member, notshown in the drawings appropriately which is made by layering a clothand rubber sheet integrally. The wiping unit 481 wipes the surface fromwhich the filter element member 13 is ejected always by a new wipingsurface. By doing this, the filter element member 13 which sticks to theejection surface is removed so as to prevent the nozzle 466 from beingclogged.

Furthermore, in the liquid drop ejecting processing apparatus 423, asshown in FIG. 22, an ink system 482 is provided. The ink system 482 isprovided with an ink tank 483 for storing the filter element member 13,a supply pipe 478 through which the filter element member 13 can pass,and a pump for supplying the filter element member 13 from the ink tank483 through the supply pipe 478 to the head unit 420. Here, in FIG. 22,disposition of the supply pipe 478 is graphically shown such that thesupply pipe 478 is connected from the ink tank 483 to the sub-scanningdriving apparatus 427 so as not to influence the movement of the headunit 420. Also, the filter element member 13 is supplied to the headunit 420 from above the sub-scanning driving apparatus 427 for drivingthe scanning operation of the head unit 420.

Also, in the liquid drop ejecting processing apparatus 423, a weightmeasuring unit 485 for measuring the ejection amount of the filterelement member 13 which is ejected from the head unit 420 is provided.

Furthermore, in the liquid drop ejecting processing apparatus 423, apair of missing-dot detecting units 487 having, for example, a lightsensors, not shown in the drawings, for monitoring ejecting condition ofthe filter element member 13 which is ejected from the head unit 420 isdisposed. In the missing-dot detecting units 487, a light source of thelight sensor, not shown in the drawings, and a light receiving sectionare disposed so as to face each other having a space through which theejected liquid drop 8 which is ejected from the head unit 420 passes inan X-axis direction which crosses diagonally a direction in which theliquid material is ejected from the head unit 420. Also, the missing-dotdetecting units 487 are disposed in a Y-axis direction in a direction inwhich the head unit 420 is transported. The missing-dot detecting unit487 detects a missing-dot by monitoring the ejection condition each timethe head unit 420 performs the sub-scanning movement so as to eject thefilter element member 13.

Although detail explanation is made later, in the head unit 420, headapparatuses 433 for ejecting the filter element member 13 are disposedin 2 arrays. By doing this, a pair of missing-dot detecting units 487are disposed so as to monitor the ejection condition for each headapparatus in each of the arrays.

(Structure of Head Unit)

Next, a structure of a head unit 420 is explained. FIG. 23 is a planview showing a head unit which is provided in the liquid drop ejectingprocessing apparatus. FIG. 24 is a side view of the head unit. FIG. 25is a front view of the head unit. FIG. 26 is a cross section of the headunit.

The head unit 420 has a head unit section 430 and an ink supply section431 as shown in FIGS. 23 to 26. Also, the head unit section 430 has aplanar carriage 426 and a plurality of head units 433 having shapeswhich are substantially the same as each other attached on the carriage426.

(Structure of Head Apparatus)

FIG. 27 is a perspective view for a head apparatus which is disposed onthe head unit in a disassembled form.

The head apparatus 433 has a printed base board 435 as shown in FIG. 27.

On the printed base board 435, various electric parts 436 are mountedand electric wirings are made. Also, on an end in the longitudinaldirection of the printed base board 435 (right-hand side in FIG. 27), awindow section 437 is opened therethrough. Furthermore, on the printedbase board 435, a flow path 438 through which the filter element member13 can pass as an ink is disposed on both sides of the window section437.

Furthermore, at nearly one end (right-hand side in FIG. 27) in thelongitudinal direction of one surface (down side in FIG. 27) of theprinted base board 435, an ink jet head 421 is attached integrally by anattaching member 440. The ink jet head 421 is formed in a rectangularshape and its longitudinal direction portion corresponds to alongitudinal portion of the printed base board 435. Here, the shapes ofeach ink jet head on each head apparatus 433 are substantially nearlythe same as each other. That is, each of ink jet heads are commonlyobtainable products according to a prescribed industrial standard aslong as they are qualified products according to the prescribedstandard. More specifically, when the ink jet heads have the same numberof nozzles in the same positions among the ink jet head, assemblingoperation of the ink jet head on the carriage becomes efficient; thus,it is preferable because the assembling accuracy increases. Furthermore,if a product which is produced according to the same manufacturing andassembling processes is used, a product which is made specially is notnecessary; thus, it is possible to decrease the manufacturing cost.

Also, at nearly the other end (left-hand side in FIG. 27) in thelongitudinal direction of one surface (up side in FIG. 27) of theprinted base board 435, connectors 441 which are connected electricallyto the ink jet head 421 are attached integrally by an attaching member440. To these connectors 441, as is graphically shown in FIG. 22,electric wirings 442 (including a power supply wiring and signal wiring)which are connected to the sub-scanning driving apparatus 427 so as notto influence the movement of the head unit 420 are connected. Theelectric wiring 442 connects the controlling apparatus not shown in thedrawings, and the head unit 420. That is, as shown in FIGS. 23 and 26 bya two-dot chain line arrow graphically, these electric wirings 442 aredisposed on an outer periphery of the head unit 420 such as both sidesof a disposition direction of the 2 arrays of the head apparatus 433 onthe head unit 420 from the sub-scanning driving apparatus 427 so as tobe connected to the connectors 441; thus, electric noise does not occur.

Furthermore, on nearly one end (right-hand side in FIG. 27) in thelongitudinal direction of the other surface (up side in FIG. 27) of theprinted base board 435, an ink introducing section 443 is attachedcorresponding to the ink jet head 421. The ink introducing section 443has a positioning cylinder section 445 disposed on the attaching member440 having nearly a cylindrical shape so as to fit to a positioning pinsection 444 which goes through the printed base board 435 and a fittingnail section 446 which fits the printed base board 435.

Also, on the ink introducing section 443, a pair of connecting section448 having nearly a cylindrical shape with a narrowing tip are disposed.These connecting sections 448 have openings, not shown in the drawings,which connect the flow path 438 of the printed base board 435 in awater-tight manner on a base end section near the printed base board435. On a tip of the connecting section 448, a hole through which thefilter element member 13 can pass is disposed.

Furthermore, to these connecting sections 448, as shown in FIGS. 24 to27, a seal connecting sections 450 are attached in the tip positionrespectively. These seal connecting sections 450 are formed in nearly acylindrical shape so as to fit the connecting member 448 in awater-tight manner with its inner circumference. Also, on a tip of theconnecting section 448, a sealing member 449 is disposed.

(Structure of Ink Jet Head)

FIG. 28 is a perspective view of an ink jet head in a disassembled form.FIGS. 29A to 29C are cross sections for showing filter element memberejection operation by the ink jet head. FIG. 29A shows an ink jet headunder conditions before the filter element member is ejected. FIG. 29Bshows an ink jet head under conditions in which the filter elementmember is ejected by a contracting movement by a piezoelectric vibratingelement. FIG. 29C shows an ink jet head under conditions immediatelyafter the filter element member is ejected. FIG. 30 is a view forexplaining ejection amount of the filter element member by the ink jethead. FIG. 31 is a view for explaining an approximate dispositioncondition of the ink jet head. FIG. 32 is an enlarged view forexplaining an approximate disposition condition of the ink jet headshown in FIG. 31.

The ink jet head 421 has a holder 451 having an approximatelyrectangular shape as shown in FIG. 28. In the holder 451, a plurality,for example, 180 pieces of piezoelectric vibrating elements 452 such aspiezo elements are disposed in 2 arrays along the longitudinaldirection. In approximately the middle of both longitudinal sides of theholder 451, through holes 453 which communicate to the flow paths 438 ofthe print base board 435 and flows the filter element member 13 as anink are disposed respectively.

Also, on a surface on which the piezoelectric vibrating element 452 ofthe holder 451 is disposed, as shown in FIG. 28, a flexible plate 455which is formed in a sheet condition by synthetic resin is disposedintegrally. On the flexible plate 455, communicating holes 456 whichcontinue to the through holes 453 are provided respectively. On theflexible plate 455, fitting holes 458 which fit the positioning nails457 which are disposed so as to protrude on four corner portions of theholder 451 are provided. The fitting holes 458 are positioned on a topsurface of the holder 451 so as to be attached there integrally.

Furthermore, on the flexible plate 455, a planar flow path forming plate460 is provided. On the flow path forming plate 460, nozzle grooves 461which are disposed serially in 2 arrays corresponding to 180 pieces ofpiezoelectric vibrating elements which are disposed in the longitudinaldirection of the holder 451, opening sections 462 which are formed inthe longitudinal direction and in one side of the holder 451, andcommunicating holes 463 which continue to the fitting holes 456 on theflexible plate 455 are provided. On the flexible plate 455, fittingholes 458 which fit the positioning nail sections 457 which are disposedon four corner portions of the holder 451 so as to protrude thereat aredisposed. The fitting holes 458 are positioned on the top surface of theholder 451 with the flexible plate 455 so as to be attached thereatintegrally.

Also, on a top surface of the flow path forming plate 460, a nozzleplate 465 having approximately a planar shape is provided. On the nozzleplate 465, 180 pieces of nozzles 466 having approximately a circularshape in a longitudinal direction of the holder 451 over 25.4 mm oflongitudinal range are disposed serially in two arrays so as tocorrespond to the nozzle grooves formed on the flow path forming plate460. On the flexible plate 455, fitting holes 458 which fit thepositioning nails 457 which are disposed so as to protrude on fourcorner portions of the holder 451 are provided. The fitting holes 458are positioned on a top surface of the holder 451 together with theflexible plate 455 and the flow path forming plate 460 so as to beattached thereat integrally.

In addition, by the flexible plate 455 which is layered, a flow pathforming plate 460, and a nozzle plate 465, as graphically shown in FIGS.29A to 29D, a liquid reservoir 467 is formed separately in an openingsections 462 formed on the flow path forming plates 460. Also, theliquid reservoir 467 communicates to each nozzle groove 461 via liquidsupply path 468. By doing this, when pressure in the nozzle grooves 461increases by vibrating movement by the piezoelectric vibrating element452, the ink jet head 421 ejects the filter element member 13 from thenozzle by ejection liquid drop amount between 2 to 13 pl, for example,10 pl, with 7±2 m/s of pump head. That is, as shown in FIGS. 29A to 29Csuccessively, by applying a predetermined voltage Vh to thepiezoelectric vibrating element 452 in a pulse manner, the piezoelectricvibrating element 452 is extended and contracted appropriately in anarrow direction Q. By doing this, the filter element member 13 as an inkis suppressed so as to be ejected from the nozzle 466 in a predeterminedamount of liquid drop 8.

Also, in the ink jet head 421, it is observed that ejection amount islarger at both ends in the disposition direction than in the rest of thedisposition direction as explained in the above-mentioned embodimentwith reference to FIG. 30. Because of this, it is controlled such thatthe filter element member 13 is not ejected from the nozzles 466 ofwhich ejection amount difference is within 5% such as each of 10 nozzlesat both ends.

In addition, in the head unit section 430 contained in the head unit420, as shown in FIGS. 22 to 26, a plurality of head apparatuses 433having the ink jet head 421 are disposed in an array manner. As shown inFIG. 31 graphically, the disposition of the head apparatuses 433 on thecarriage 426 is under conditions that the head apparatuses 433 aredisposed in a direction which is slanted more in an X-axis directionwhich is a main scanning direction which crosses orthogonally to theY-axis direction than in the Y-axis which is a sub-scanning direction ina offset manner. That is, a plurality, for example, 6 pieces of the headunit sections are disposed in a direction which is slanted more slightlythan the Y-axis direction as a sub-scanning direction in an arraymanner. Here, plural arrays are disposed, for example, two arrays. In anordinary disposition of the ink jet heads 421, the width of the headapparatus 433 in its latitudinal direction is larger than the ink jethead; thus, it is not possible to narrow disposition interval of theneighboring ink jet heads 421. However, arrays of the nozzle 466 must bein line with the Y-axis direction; therefore, the above-explaineddisposition of the head apparatuses 433 are provided.

Furthermore, in the head unit section 430, as shown in FIGS. 23 and 31,head apparatuses 433 are disposed along a line which is slightly offsetfrom the Y-axis direction to the X-axis direction as a main scanningdirection. Also, the connectors 441 are disposed approximately inpoint-symmetry manner outside of the arrays of the head apparatuses 433disposed facing each other in 2 arrays. Here, the head apparatuses 433are disposed such that the nozzles 466 disposed in the longitudinaldirection of the ink jet head 421 are disposed to be slanted closer inthe X-axis direction by, for example, 57.1 degrees.

Also, the head apparatuses 433 are disposed in a staggered manner so asnot to be disposed in rows against the disposition direction. That is,as shown in FIGS. 23, 26, and 31, the ink jet head 421 are disposed intwo arrays such that nozzles 466 in 12 (twelve) pieces of ink jet head421 are disposed in the Y-axis direction continuously and in a staggeredmanner in which the ink jet heads 421 are disposed one by onealternatingly between facing arrays.

More specifically, detailed explanation is made with reference to FIGS.31 and 32. Here, the disposing directions of the nozzles 466 which aredisposed in a longitudinal direction of the ink jet head 421 are slantedcloser in the X-axis direction. By doing this, in a first array of thenozzles 466 disposed in two arrays on the ink jet head 421, on a line inthe X-axis direction in which the eleventh nozzle 466 is disposed forejecting the filter element member 13, there is an area A (A in FIG. 32)in which 10 nozzles 466 disposed in a second array do not eject thefilter element member 13. That is, in one ink jet head 421, there is thearea A in which there are not two nozzles 466 in a line in the X-axisdirection.

Therefore, as shown in FIGS. 31 and 32, in an area B (B shown in FIG.32) in which two pieces of nozzle 466 in an ink jet head 421 aredisposed in the X-axis direction, the head apparatuses 433 which aredisposed in an array manner are not disposed in a row in the X-axisdirection. Furthermore, the area A in which only one nozzle on the headapparatus 433 forming one array is disposed on the X-axis direction andthe area A in which only one nozzle on the head apparatus 433 formingthe other array is disposed on the X-axis direction are disposed in rowseach other in the X-axis direction. Between the ink jet head 421 in onearray and the ink jet head 421 in the other array, a total of twonozzles 466 are disposed on a line which is in the X-axis direction.That is, in the area in which the ink jet head 421 is disposed, a totalof two nozzles 466 are disposed in a staggered manner such that twopieces of nozzle 466 are disposed on a line which is in the X-axisdirection. Here, nozzles in an area X of the nozzles 466 which do noteject the filter element member 13 are not regarded as two nozzles 466on a line which is in the X-axis direction. By doing this, two nozzles466 which eject the ink in the X-axis direction in which the mainscanning operation is performed are disposed on a line. As explainedlater, the ink is ejected from two nozzles 466 to one point. If oneelement is formed by only one nozzle 466, different ejection amountsamong the nozzles 466 cause different ejecting characteristics among theelements and decreased yield. Therefore, if one element is formed bydifferent nozzles 466, it is possible to overcome the difference inejection amount by the nozzles 466 and equalize the ejectingcharacteristics among elements and improve the product yield.

(Structure of Ink Supply Section)

As shown in FIGS. 23 to 26, the ink supply section 431 comprises a pairof attaching plates 471 which are provided corresponding to two arraysof the head unit sections 430 and a plurality of supplying unit sections472 which are attached to the attaching plates 471. The supplying unitsection 472 has movable members 474 having approximately a cylindricalshape. The movable members 474 are attached by the attaching fixtures473 so as to penetrate through the attaching plates 471 movably in anaxial direction. The movable members 474 of the supplying unit section472 are attached by, for example, coil springs 475 or the like so as tobe pushed in a direction toward the head apparatus 433 from theattaching plate 471. Here, in FIG. 23, the ink supplying section 431 isshown only for one array of the head apparatuses 433 among two arraysand the other array is omitted for the convenience of explanation.

On an end section of the movable member 474 which is facing the headapparatus 433, flange sections 476 are provided. The flange section 476protrudes like a sword-guard around the outer periphery of the movablesection 474. The end of the flange section 476 contacts a sealing member449 of the ink introducing section 443 in the head apparatus 433 inapproximately water-tight manner so as to resist the pushing force bythe coil spring 475. Also, on an end of the movable member which isopposite to the flange section 476, a joint section 477 is provided. Asshown graphically in FIG. 22, an end of the supplying pipe 478 in whichthe filter element member 13 flows through is connected to the jointsection 477.

As explained above and graphically shown in FIG. 22, the supplying pipe478 is connected to the sub-scanning driving apparatus 427 so as not toinfluence the movement of the head unit 420. Also, as graphically shownin FIGS. 23 and 25 by one-dot chain line arrow, the supplying pipe 478is connected from the sub-scanning driving unit 427 to an approximatelymiddle between the ink supplying sections which are disposed in twoarrays from above the head unit 420. Furthermore, the supplying pipes478 are disposed radially and an end of the supplying pipe 478 isconnected to the joint section 477 of the ink supplying section 431.

In addition, the ink supplying section 431 supplies the filter elementmember 13 which flows through the supply pipe to the ink introducingsection 443 in the head apparatus 433. Also, the filter element member13 which is supplied to the ink introducing section 443 is supplied tothe ink jet head 421 and ejected from nozzles 466 of the ink jet head421 which is controlled electrically appropriately in a form of liquiddrop 8.

(Manufacturing Operation of Color Filter)

(Preparatory Process)

Next, a forming process for a color filter 1 by using a manufacturingapparatus for a color filter according to the above-explained embodimentis explained with reference to drawings. FIG. 34 shows manufacturingsteps S1 to S7 for the color filter 1 by using a manufacturing apparatusfor a color filter in a form of cross section.

First, surface of the motherboard 12 as a transparent base board made ofnon-alkali-glass having a thickness of 0.7 mm, a length of 38 cm, and awidth of 30 cm, is cleaned by a cleaning liquid which is made of aconcentrated sulfuric acid to which 1 mass % of hydrogen peroxidesolution is added. After the cleaning operation, the motherboard 12 isrinsed with pure water and dried by air so as to obtain a clean surface.A chrome coating having 0.2 μm of thickness on average is formed on thesurface of the motherboard 12 by a coating method such as, for example,sputtering method, so as to obtain a metal layer 6 a (step S1 in theFIG. 34)

After the motherboard 12 is dried on a hot plate under conditions of80□, for five minutes, a photoresist layer which is not shown in thedrawing is formed on the surface of the metal layer 6 a by, for example,a spin coating method. A mask film which is not shown in the drawing onwhich, for example, a predetermined matrix pattern shape is formed iscontacted on the surface of the motherboard 12 so as to be exposed toultraviolet light. Next, the exposed motherboard 12 is dipped into analkali-developer liquid which contains 8 mass % of potassium hydroxide,and non-exposed portion of photoresist is removed, and a patterningoperation is performed on a resist layer. Consequently, etching removaloperation is performed on the exposed metal layer 6 a by an etchingliquid containing, for example, hydrochloric acid as a main ingredient.By doing this, a shielding layer 6 b as a black matrix having apredetermined matrix pattern is obtained (step S2 in FIG. 34). Here,thickness of the shielding layer 6 b is approximately 0.2 μm, and thewidth of the shielding layer 6 b is approximately 22 μm.

Furthermore, a negative transparent acrylic photosensitive resinformation 6 c is applied on the motherboard 12 on which the shieldinglayer 6 b is formed by, for example, a spin coating method (step S3 inFIG. 34). Pre-baking operation is performed to the motherboard 12 onwhich the photosensitive resin formation 6 c is formed under conditionsof 100□ for 20 minutes, and after that, the motherboard 12 is exposed toultra violet light by using a mask film, which is not shown in thedrawing, on which a predetermined matrix pattern shape is formed.Consequently, a resin on the non-exposed area is developed by, forexample, the above-mentioned alkali-developer liquid, and rinsed by purewater, and then, a spin drying operation is performed. As a final dryingoperation, an after-baking operation is performed under condition of,for example, 200□ for 30 minutes so as to harden the resin portionsufficiently; thus, a bank layer 6 d is formed. Average thickness of thebank layer 6 d is nearly 2.7 μm, and the width is nearly 14 μm. Abulkhead 6 is formed by the bank layer 6 d and the shielding layer 6 b(step S4 in FIG. 34).

Dry etching operation and plasma processing are performed so as toimprove ink wettability of the filter element forming area 7 (inparticular, exposed surface of the motherboard 12) as a color layerforming area which is separated by the above-obtained shielding layer 6b and the bank layer 6 d. More specifically, for example, high voltagecurrent is charged to a mixed gas of helium and 20% of oxygen, and anetching spot is formed by performing the plasma processing. Themotherboard 12 is transported under the above-formed etching spot so asto be etched; thus, pre-processing of the motherboard 12 is performed.

(Ejection of Filter Element Member)

Next, each of filter element members such as those of Red (R), green(G), and blue (B) is introduced (that is, ejected) to the inside thefilter element forming area 7 which is separated by the bulkhead 6 ofthe motherboard 12 to which the above-mentioned pre-processing isperformed by an ink jet method (step S5 in FIG. 34).

When the filter element member is ejected by the ink jet method, a headunit 420 is assemble in advance. In addition, in each of the liquid dropejection processing apparatuses 405R, 405G, and 405B in the liquid dropejecting apparatus, ejection amount of the filter element member 13which is ejected from a nozzle 466 of each ink jet head 421 is adjustedto be a predetermined amount, such as nearly 10 pl. On the other hand,on one surface of the motherboard 12, the bulkhead 6 is formed in a gridpattern in advance.

In addition, at first, the motherboard 12 to which the pre-processingwas performed as explained above is transported into the liquid dropejection processing apparatus 405R for R color by a transporting robot,which is not shown in the drawing, so as to put the motherboard 12 onthe base stand section in the liquid drop ejection processing apparatus405R. The motherboard 12 which is put on the base stand section ispositioned so as to be fixed thereon by a placing method, for example,an absorption method. Position of the motherboard 12 is monitored byvarious cameras, and the movement of the base stand section on which themotherboard 12 is supported is controlled so as to be in a predeterminedappropriate position by controlling the main scanning driving apparatus425. Also, the head unit 420 is moved appropriately by the sub-scanningdriving apparatus 427 so as to acknowledge the position thereof. Afterthat, the head unit 420 is moved in the sub-scanning direction, and theejection conditions of the nozzle 466 is monitored by the missing-dotdetecting unit 487 so as to confirm no occurrence of defective ejection;thus, the head unit 420 is transported to the initial position.

After that, the motherboard 12 which is supported on the base standsection which movable by the main scanning driving unit 425 is scannedin the X-axis direction. While the head unit 420 is moved relatively tothe motherboard 12, the filter element member 13 is ejected from thepredetermined nozzle 466 of the ink jet head 421 appropriately. Thefilter element member 13 is filled in the concave section which isseparated by the bulkhead 6 on the motherboard 12. It is controlled by acontrolling apparatus which is not shown in the drawing such that thefilter element member 13 is not ejected from a predetermined area X, forexample, 10 nozzles located on both ends in the disposition direction ofthe nozzle 466 as shown in FIG. 32. The filter element member 13 isejected from 160 nozzles 466 of which the ejection amount is relativelyuniform in the middle position of the nozzle array.

Also, because 2 nozzles 466 are located on the scanning line such as ona line which is on the scanning direction, 2 dots are ejected from onenozzle 466 to one concave section during the movement. Morespecifically, 2 liquid drops 8 are ejected as one dot from one nozzle466. Therefore, in total, 8 liquid drops 8 are ejected from the nozzle466. The ejection condition is monitored in every scanning movement bythe missing-dot detecting unit 487 whether or not a missing-dot exists.

When the missing-dot is determined not to exist, the head unit 420 ismoved in the sub-scanning direction by a predetermined distance. Whilethe base stand section which supports the motherboard 12 is moved againin the main scanning direction, the ejection for the filter elementmember 13 is repeated. Thus, the filter element 3 is formed in apredetermined filter element forming area 7 in the predetermined colorfilter forming area 11.

(Drying and Hardening)

Consequently, the motherboard 12 to which the R color filter elementmember 13 is ejected are taken out by the liquid drop ejectionprocessing apparatus 405R by a transporting robot, which is not shown inthe drawing. The filter element member 13 is dried by a multi-stagebaking furnace, which is not shown in the drawing, under condition of,for example, 120□ for five minutes. After the drying operation, themotherboard 12 is taken out from the multi-stage baking furnace by thetransporting robot, and then the motherboard 12 is cooled during thetransportation. After that, the motherboard 12 is transported into theliquid drop ejection processing apparatus 405R, the liquid drop ejectionprocessing apparatus 405G for G color, and the liquid drop ejectionprocessing apparatus 405B for B color successively. The filter elementmembers 13 for G color and the B color are ejected successively to thepredetermined filter element forming area 7. In addition, themotherboard 12 of which ejected filter element members 13 for threecolors are dried are collected. Furthermore, the filter element members13 are fixed and settled on the motherboard 12 by performing a heatingprocessing (step S6 in FIG. 34).

(Formation of Color Filter)

A protecting coating 4 is formed on nearly the entire surface of themotherboard 12 on which the filter element 3 is formed. Furthermore, anelectrode layer 5 which is made from, for example, ITO (Indium-TinOxide) is formed on a surface of the protecting coating 4 by therequired pattern. After that, a plurality of color filters 1 is obtainedby cutting the motherboard 12 in accordance with the color filterforming area 11 (step S7 in FIG. 34). The motherboard 12 on which thecolor filter 1 is formed is used as one of a pair of base boards in theliquid crystal apparatus shown in FIG. 18 as explained in the embodimentpreviously.

(Effect of Manufacturing Apparatus for Color Filter)

According to the embodiment as shown in FIGS. 22 to 34, there are thefollowing effects in addition to the operational effects in eachembodiment explained previously.

That is, a plurality of ink jet heads 421 in which a plurality of nozzleheads 466 for ejecting the filter element member 13 as a fluid liquidmaterial such as an ink as a liquid drop 8 are disposed in arrays on asurface of the ink jet heads 421 and are moved along a surface of themotherboard 12 relatively under conditions that a surface on which thenozzles 466 of the ink jet heads 421 is facing a surface of themotherboard 12 as a member to receive ejection while having apredetermined space therebetween. One filter element member 13 isejected on a surface of the motherboard 12 from each nozzle 466 of aplurality of the ink jet heads 421. Because of this, it is possible toeject the filter element member 13 over a wide range of the motherboard12 by using substantially the common ink jet head 421 based on the sameindustrial standard. Also, it is possible to use a plurality ofconventional standardized parts without using a long-range ink jet head;thus, it is possible to reduce manufacturing cost. The product yield ofthe long-range ink jet head is quite low; thus it becomes expensive.However, the product-yield of a short-range ink jet head 421 is high;therefore, a plurality of short-range ink jet head is disposed in thepresent invention so as to obtain substantially the same effect as thecase in which the long-range ink jet head is used; thus, it is possibleto reduce manufacturing cost.

Furthermore, for example, by appropriately setting the dispositiondirection and the number of the ink jet head 421 and the number and theinterval (nozzles 466 can be used by every piece or by every severalpieces so as to correspond to the pitch of the pixel) of the nozzles 466which are used for ejecting operation, it is possible to make the areato which the filter element member 13 is ejected correspond to the colorfilter 1 having different size, pixel pitch, and disposition. Therefore,common utility can be increased.

In addition, because the shape of a plurality of the liquid dropejecting heads 421 is substantially the same, it is possible to make onekind of ink jet head 421 correspond to the area to which the liquidmaterial is ejected by setting the array appropriately. Therefore, thestructure becomes simple, and the production yield improves, and themanufacturing cost can be reduced.

Also, because the nozzle 466 uses a plurality of the liquid dropejecting heads 421 which are aligned in an array in nearly and equalinterval, it is possible to dot a pattern following a predetermined rulesuch as a striped pattern, mosaic pattern, or delta pattern easily.

In addition, a plurality of ink jet heads 421 are moved along a surfaceof the motherboard 12 relatively such that a plurality of ink jet heads421 are along with a slanted direction which crosses the dispositiondirection of the nozzles 466 which are disposed in approximately alinear form against the main scanning direction along a surface of themotherboard 12 relatively. Therefore, the disposition direction of thenozzles 466 of a plurality of the ink jet heads 421 becomes slanted tothe main scanning direction as a moving direction along a surface of themotherboard 12. By doing this, the pitch which is an ejection intervalof the filter element member 13 becomes narrower than the pitch betweenthe nozzles. When, for example, the motherboard 12 to which the filterelement member 13 is ejected is used for a display apparatus such as anelectrooptical apparatus such as a liquid crystal panel, clearer displayis obtained. Thus, it is possible to obtain a desirable displayapparatus. Furthermore, it is possible to prevent an interference of theneighboring ink jet heads 421; thus, it is possible to realize smallsize apparatus. In addition, by setting the slanting angleappropriately, the dot pitch is set appropriately; thus, the commonutility can be improved.

Furthermore, in the ink jet head 421 in which the nozzles 466 aredisposed on nearly a linear form with nearly equal interval, the nozzles466 are disposed on nearly a linear form with nearly equal intervals ina longitudinal direction of the rectangle ink jet head 421. Therefore,the ink jet head 421 be made smaller. Thus, for example, it is possibleto prevent the interference between the neighboring ink jet heads 421 orbetween the ink jet head 421 and other structural members; thus, a smallapparatus can be realized easily.

Also, the head unit 420 is disposed such that a plurality of ink jethead 421 are disposed on a carriage 426 under condition that thedisposition directions of the nozzles 466 are nearly in parallel.Therefore, it is possible to form a plurality of ejection areas of oneliquid material in one area without using a long-range ink jet head.Furthermore, it becomes possible to eject the filter element member 13in duplicated condition from the ink jet heads 421 which are duplicatedin one position. Therefore, it is possible to equalize the ejectionamount in the ejection area easily; thus, it is possible to obtainstable and desirable dot formation.

In addition, a plurality of the ink jet heads 421 are slanted in adirection which crosses the main scanning direction and the nozzles 466are disposed in a different direction from a longitudinal direction ofthe ink jet head 421 such that the disposition directions of all of thenozzles 466 are in parallel. Therefore, it is possible to enlarge anarea for ejection easily without manufacturing a special long-range inkjet head. Furthermore, the disposition directions of the nozzles 466 areslanted to a direction which crosses the scanning direction, asexplained above, the neighboring ink jet heads 421 do not interfere, andthe pitch which is ejection interval of the filter element member 13becomes narrower than the pitch between the nozzles 466. For example,when the motherboard 12 to which the filter element member 13 is ejectedis used for a display apparatus or the like, cleaner display conditioncan be obtained. Also, by setting the slanting angle appropriately, thedot pitch of the dot description are set appropriately; thus, the commonutility improves.

Also, a plurality of ink jet heads 421 are disposed in a plurality ofarrays, for example, 2 arrays in a staggered manner; therefore, speciallong-range ink jet heads 421 need not be used. Even if the commonlyobtainable ink jet heads 421 is used, the neighboring ink jet heads donot interfere therewith. Also, an area in which the filter elementmember 13 is not ejected between the ink jet heads 421 does not occur.Therefore, it is possible to eject the filter element member 13desirably, in other words, continuously.

In addition, a plurality of ink jet heads 421 on surface of whichnozzles 466 which eject the filter element member 13 as a fluid liquidmaterial such as an ink are provided are moved along a surface of themotherboard 12 relatively such that a surface of the ink jet head 421 onwhich the nozzles 466 are provided faces a surface of the motherboard 12as a substance to receive the ejection with a predetermined spacetherebetween. The filter element member 13 is ejected from a plurality,for example, two nozzles 466 which are located on a line along therelative moving direction. By doing this, a feature in which the filterelement member 13 is ejected form two different nozzles 466 induplicating manner is obtained. Therefore, even if the ejection amountdiffers among a plurality of nozzles 466, the ejection amount of thefilter element member 13 is equalized; thus, it is possible to preventunequal ejection amounts. Also, it is possible to obtain a uniformejection on a plane, and it is possible to provide an electroopticalapparatus having desirable characteristics in planar quality.

Also, a plurality of ink jet heads 421 on surface of which nozzles 466which eject the filter element member 13 are provided are moved along asurface of the motherboard 12 relatively such that a surface of the inkjet head 421 on which the nozzles 466 are provided faces a surface ofthe motherboard 12 as a substance to receive the ejection with apredetermined space therebetween. Among the nozzles 466 of the ink jethead 421, the filter element member 13 is not ejected from a plurality,for example, 10 nozzles 466, in a predetermined area X which are on bothends of the linearly-disposed line of the nozzles 466. The filterelement member 13 is ejected from the nozzles 466 which are provided notin the predetermined area X but in the center of the rest of the area.By doing this, the filter element member 13 is not ejected from 10nozzles 466 which are provided in the predetermined area which are onboth ends of the linearly-disposed line of the nozzles 466 whereejection amount is larger. The filter element member 13 is ejected fromthe nozzles 466 in the middle of the linearly-disposed line of thenozzles 466 where ejection amount is relatively uniform. Therefore, itis possible to eject the filter element member 13 on the motherboard 13uniformly in plane. Thus, a color filter 1 having uniform plane qualitycan be obtained. Also, in an electrical optical apparatus using thecolor filter 1, desirable display characteristics can be realized.

Furthermore, the filter element member 13 is not ejected from nozzles466 of which the ejection amount is larger than the average ejectionamount by more than 10%. Therefore, in particular, even if filterelement member 13 of the color filter 1, EL illuminating member, andfunctional liquid material containing charged grain for anelectrophoretic apparatus are used as a liquid material, there is nodifference in the ejection amount characteristics. Therefore, desirableejection amount characteristics for an electrooptical apparatus such asa liquid crystal apparatus and an EL apparatus can be obtained securely.

Also, the filter element member 13 is ejected within tolerance of ±10%of average ejection amount from each of the nozzles 466. Therefore, theejection amount becomes relatively uniform; thus, the filter elementmember 13 is ejected on a surface of the motherboard 12 uniformly in aplanar manner. Therefore, an electrooptical apparatus having desirablecharacteristics can be provided.

Furthermore, a missing-dot detecting unit 487 is provided so as tomonitor the ejection condition of the filter element member 13 which isejected from the nozzles 466. Therefore, it is possible to preventnon-uniform ejection of the filter element member 13; thus, liquidmaterial ejection for desirable and reliable dotting can be realized.

In addition, an optical sensor is provided on the missing-dot detectingunit 487 so as to detect whether or not the filter element member 13passes through in a direction which crosses orthogonally an ejectiondirection of the filter element member 13. Therefore, even during theejection process of the filter element member 13, it is possible toacknowledge the ejection condition of the filter element member 13securely by an easy structure. Also, it is possible to preventnon-uniform ejection of the filter element member 13; thus, ejection ofthe filter element member for desirable and reliable dot description canbe realized.

The ejection condition of the filter element member 13 is monitored bythe missing-dot detecting unit 487 before and after the ejecting processof the filter element member 13 on the motherboard 13 from the nozzles466. Therefore, it is possible to monitor the ejection condition of thefilter element member 13 just before the ejection of the filter elementmember 13 and immediately after the ejection thereof. Also, it ispossible to confirm the ejection condition of the filter element member13 reliably; thus, it is possible to obtain desirable dotting operationby reliably preventing the missing of dots. Here, it is acceptable thatthe detecting operation of whether or not there is a dot which ismissing is performed before or after the ejecting process.

Also, the missing-dot detecting unit 487 is disposed in an area in whichthe main scanning direction of the head unit 420 is directed. Therefore,it is acceptable that the movement distance of the head unit 420 beshort so as to monitor the ejection condition of the filter elementmember 13. Also, a movement for ejection in the main scanning directioncan be realized by a simple structure. Thus, it is possible to detectthe missing-dot by a simple structure.

In addition, the ink jet heads 421 are disposed in 2 arrays in apoint-symmetry manner. Therefore, supply pipes 478 for supplying thefilter element member 13 can be assembled near the head unit 420.Therefore, it is possible to assemble the apparatus and maintain thereofeasily. Furthermore, electric wirings 442 which are used for controllingthe ink jet head 421 are connected from both sides of the head unit 420.Therefore, it is possible to prevent the influence of electric noisecaused by the electric wirings; thus, it is possible to realizedesirable superior dotting operation.

Furthermore, a plurality of ink jet heads 421 on an end of the printedbase board 435 which is in a slit form, and a connector 441 be providedon the other end. Therefore, even if the connectors 441 are disposed ina plurality of lines, the connectors 441 do not interfere with eachother; thus, it is possible to reduce the size of the apparatus. Also,an area is not formed in which the nozzles 466 in the main scanningdirection do not exist. Therefore, it is possible to provide nozzles 466in continuous array; thus, it is not necessary to use a speciallong-range ink jet head.

Additionally, the connectors 441 are disposed in a point-symmetry mannerso as to be opposite to each other; therefore, it is possible to preventan influence of electric noise caused in the connector 441. Therefore,it is possible to provide desirable and stable dotting operation.

Here, it is understood that, in the above-explained embodiments, thesame effect can be obtained by the same structure.

(Embodiment of a Manufacturing Method for an Electrooptical ApparatusUsing EL Element)

Next, a manufacturing method for an electrooptical apparatus accordingto the present invention is explained with reference to drawings. Here,an active-matrix display apparatus using EL element is explained as theelectrooptical apparatus. Before explaining the manufacturing method forthe display apparatus, the structure of a display apparatus which issupposed to be manufactured is explained.

(Structure of Display Apparatus)

FIG. 35 is a view showing a part of a circuit in an organic EL apparatuswhich is used in the manufacturing apparatus for the electroopticalapparatus according to the present invention. FIG. 36 is an enlargedplan view showing a pixel area of the display apparatus.

That is, in FIG. 35, reference numeral 501 indicates an active matrixdisplay apparatus which uses an EL displaying element as an ELapparatus. On a display base board 502 of the display apparatus 501, aplurality of scanning lines 503, a plurality of signal lines 504 whichextend in a direction which crosses these scanning lines 503, and aplurality of common electricity supplying lines 505 are connected toeach other. In addition, in each crossing points of the scanning lines503 and the signal lines 504, pixel areas 501A are provided.

To the signal lines 504, a shift register, a level shifter, video lines,and a data side driving circuit 507 having an analogue switch areconnected. Also, to the scan lines 503, a scan side driving circuit 508having the shift register and a level shifter are connected.Additionally, to each of the pixel areas 501A, a switching thin filmtransistor 509 to a gate electrode of which the scan signal is suppliedvia the scan lines 503, an accumulating capacity cap for storing andretaining an image signal which is supplied from the signal line 504 viathe switching thin film transistor 509, a current thin film transistor510 to the gate electrode of which the image signal which is stored inthe accumulating capacity cap is supplied, a picture element electrode511 to which the driving current flows in from the common electricitysupplying line 505 when the pixel electrode 511 is connected to thecommon electricity supplying line 505 electrically via the current thinfilm transistor 510, and an illuminating element 513 which aresandwiched by the pixel electrode 511 and a reflecting electrode 512 areprovided.

By doing this, when the scan line 503 is driven and the switching thinfilm transistor 509 is turned on, a potential of the signal line 504 atthe time is retained in the accumulating capacity cap. On/off conditionof the current thin film transistor 510 is determined according to thecondition of the accumulating capacity cap. In addition, via channels ofthe current thin film transistor 510, electric current flows from thecommon electricity supplying line 505 to the pixel electrode 511Furthermore, electric current flows to the reflecting electrode 512 viathe illuminating element 513. By doing this, the illuminating element513 is illuminated according to the amount of the electric current whichflows therethrough.

Here, in the pixel area 501A, as shown in FIG. 36 which is an enlargedview of pixel area without the reflecting electrode 512 and theilluminating element 513, four members of the pixel electrode 511 inrectangular shape under planar condition are surrounded by the signalline 504, common electricity supplying line 505, scan line 503, and ascan line 503 for the scan line 503 and other pixel electrode 511 whichis not shown in the drawing.

(Manufacturing Process for Display Apparatus)

Next, manufacturing process for manufacturing an active-matrix displayapparatus which uses the above-explained EL displaying element isexplained. FIGS. 37A to 39D are views showing manufacturing processesfor an active-matrix display apparatus which uses the EL displayingelement.

(Preparatory Processing)

First, as shown in FIG. 37A, on a transparent displaying base board 502,a base protecting layer as a silicon oxide layer having a thickness ofapproximately 2,000 to 5,000 angstroms, which is not shown in thedrawing, is formed by plasma CVD (Chemical Vapor Deposition) methodusing tetraethoxysilane (TEOS) and oxygen gas as a material gasaccording to necessity. Next, temperature of the displaying base board502 is set to nearly 350°, and a semiconductor layer 520 a such as anamorphous silicon layer having a thickness of approximately 300 to 700angstroms is formed on the base protecting layer by a plasma CVD method.After that, crystallizing processes such as laser annealing methods orsolid growth methods are performed on the semiconductor layer 520 a;thus, the semiconductor layer 520 a is crystallized to a polysiliconlayer. Here, in a laser annealing method, a line beam having awavelength of an excimer laser, such as approximately 400 nm is used,and its output intensity is nearly 200 mJ/cm². The line beam is scannedsuch that a portion of the line beam which corresponds to 90% of thepeak of the laser intensity in the latitudinal direction overlaps ineach area.

In addition, as shown in FIG. 37B, patterning operation is performed onthe semiconductor layer 520 a so as to form a semiconductor layer 520 bin a manner of an isolated island. On a surface of the displaying baseboard 502 on which the semiconductor layer 520 b is formed, a siliconoxide layer having a thickness of approximately 600 to 1,500 angstromsor a gate insulating layer 521 a such as a nitrided layer is formed byplasma CVD method by using TEOS or oxygen gas as a material gas. Here,the semiconductor layer 520 b becomes a channel area or a source drainarea of the current thin film transistor 510. Also, in a different crosssectional position, a semiconductor layer which becomes the channel areaand the source drain area of the switching thin film transistor 509which is not shown in the drawing is formed. That is, in a manufacturingprocess as shown in FIGS. 37A to 39D, two types of switching thin filmtransistors 509 and current thin film transistors 510 are formedsimultaneously. Manufacturing process for these transistors are thesame; therefore, in the following explanation, only the current thinfilm transistor 510 is explained, and the explanation for the switchingthin film transistor 509 is omitted.

After that, as shown in FIG. 37C, a conductive layer as a metal filmsuch as aluminum, tantalum, molybdenum, titanium, and tungsten is formedby a sputtering method, and a patterning operation is performed thereto;thus, a gate electrode 510A is formed as shown in FIG. 36. Under thiscondition, a high temperature phosphor ion is shot therein so as to formsource drain areas 510 a and 510 b on a gate electrode 510A on thesemiconductor layer 520 b in self-automatic manner. Here, a portion inwhich impurities are not introduced becomes a channel area 510 c.

Next, as shown in FIG. 37D, after an inter-layer insulating layer 522 isformed, contact holes 523 and 524 are formed. Furthermore, relayelectrodes 526 and 527 are buried in the contact holes 523 and 524.

Furthermore, as shown in FIG. 37E, on the inter-layer insulating layer522, a signal line 504, a common electricity supplying line 505, and ascan line 503 (not shown in FIGS. 37A to 37E) are formed. At this time,wirings such as signal line 504, a common electricity supplying line505, and a scan line 503 are formed in sufficient thickness withregardless of the necessary thickness for wirings. More specifically, itis preferable that each wiring should be formed in, for example,thickness of 1 to 2 μm. Here, it is acceptable that the relay electrode527 and each wiring are formed by the same manufacturing process. Atthis time, the relay electrode 526 is formed by an ITO layer asexplained later.

In addition, the inter-layer insulating layer 530 is formed so as tocover a top surface of each wiring, and a contact hole 532 is formed ina corresponding position to the relay electrode 526. An ITO layer isformed so as to bury the contact hole 532. By performing a patterningoperation on the ITO layer, a pixel electrode 511 which is connected tothe source drain area 510 a electrically at a predetermined positionwhich is surrounded by the signal line 504, the common electricitysupplying line 505, and the scan line 503 is formed.

Here, in FIG. 37E, an area which is sandwiched between the signal line504 and the common electricity supplying line 505 is equivalent to thepredetermined position to which an optical member is disposedselectively. Furthermore, between the predetermined position and itsperipheral region, a gap 535 is formed by the signal line 504 and thecommon electricity supplying line 505. More specifically, thepredetermined position is lower than the peripheral region; thus a gap535 having a concave section is formed.

(Ejection of EL Illuminating Member)

Next, an EL illuminating member as a functional liquid material isejected to the displaying base board 502 to which the preparatoryprocessing was performed by an ink jet method. That is, as shown in FIG.38A, an optical member 540A, such as a solvent-like precursor which isdissolved by a solvent, as a functional liquid material for forming apositive hole ejection layer 513A which is equivalent to a lower layerof the illuminating element 140 is ejected under condition that a topsurface of the displaying base board 502 on which the preparatoryprocessing was performed faces above by using an apparatus according toeach embodiment by the ink jet method; thus, the optical member 540A isapplied to an area in the predetermined position which is surrounded bythe gap 535 selectively.

For an optical member 540A for forming the positive hole ejection layer513A, polyphenylene vinylene (the polymer precursor for which ispolytetrahydrothiophenyl phenylene),1,1-bis(4-N,N-ditolylaminophenyl)cyclohexane, tris(8-hydroxyquinolinol)aluminum.

Here, at the time of ejection, because the fluidity of the fluid opticalmember 540A is high, the optical member 540A expands in planardirections as similar to the case in which the filter element member 13is ejected to the bulkhead according to each embodiment. However, thegap 535 is formed so as to surround the area on which the optical member540A is applied; therefore, unless ejection amount of the optical member540A in one time is extremely large, it is possible to prevent theoptical member 540A from expanding over the gap 535 outside thepredetermined position.

Furthermore, as shown in FIG. 38B, the solvent for the liquid opticalmember 540A is evaporated by a heating method or a light emitting methodso as to form a thin solid positive hole ejection layer 513A on thepixel electrode 511. The processes shown in FIGS. 38A and 38B arerepeated a necessary number of times, and as shown in FIG. 38C, apositive hole ejection layer 513A having a sufficient thickness isformed.

Next, as shown in FIG. 39A, the optical member 540B, under condition ofa solvent-like organic illuminating member which is dissolved in thesolvent, as a functional liquid material for forming the organicsemiconductor layer 513B on a surface of the illuminating element 513 isejected such that the top surface of the displaying base board 502 facesupward by using the apparatus in each embodiment by the ink jet method.The optical member 540B is applied in the area which is equivalent tothe predetermined position which is surrounded by the gap 535. Here, asexplained above, the optical member 540B is prevented from expandingoutside the predetermined position over the gap 535 as similar to a caseof the ejection of the optical member 540A.

For an optical member 540B for forming the organic semiconductor layer513B, a cyano-substituted polyphenylene vinylene, a polyphenylenevinylene, a polyalkyl phenylene,2,3,6,7-tetrahydro-11-oxo-1H,5H,11H-[1]benzopyrano[6,7,8-ij]-quinolizin-10-carboxylicacid, 1,1-bis-(4-N,N-ditolylaminophenyl)cyclohexane,2-(3,4′-dihydroxyphenyl)-3,5,7-trihydroxy-1-benzopyrylium perchlorate,tris(8-hydroxyxylenol)aluminum,2,3,6,7-tetrahydro-9-methyl-11-oxo-1H,5H,11H-[1]benzopyrano[6,7,8-ij]-quinolizin,an aromatic diamine derivative (TDP), an oxadiazole dimer (OXD), anoxadiazole derivative (PBD), a distyrylarylene derivative (DSA), aquinolinol metal complex, a beryllium-benzoquinolinol complex (Bebq), atriphenylamine derivative (MTDATA), a distyryl derivative, a pyrazolinedimer, rubrene, quinacridone, a triazole derivative, a polyphenylene, apolyalkylfluorene, a polyalkylthiophene, an azomethine zinc complex, aporphyrin zinc complex, a benzoxazole zinc complex, a phenanthrolineeuropium complex, and the like are used.

Next, as shown in FIG. 39B, the solvent for the liquid optical member540B is evaporated by a heating method or a light emitting method so asto form a thin solid organic semiconductor layer 513B on the positivehole ejection layer 513A. The processes shown in FIGS. 39A and 39B arerepeated a necessary number of times, and as shown in FIG. 39C, apositive hole ejection layer 513B having a sufficient thickness isformed. By the positive hole ejection layer 513A and the organicsemiconductor layer 513B, the illuminating element 513 is made. Finally,as shown in FIG. 39D, a reflecting electrode 512 is formed on an entiresurface of the displaying base board 502 or in a striped manner; thus,the displaying base board 501 is manufactured.

In each of the embodiments shown in FIGS. 35 to 39D, by performing thesame ink jet method as in the each of the above-explained embodiments,it is possible to provide similar operational effects. Furthermore, whenthe functional liquid material is applied selectively, it is possible toprevent the functional liquid material from flowing therearound; thus,it is possible to perform the patterning operation in high accuracy.

Here, in embodiments shown in FIGS. 35 to 39D, an active-matrix displayapparatus using an EL displaying element for color display operation isexplained. In addition, as shown in FIGS. 40A to 40D, the structuresshown in FIGS. 35 to 39D can be applied to a display apparatus for asingle color.

That is, it is acceptable for the organic semiconductor layer 513B to beformed uniformly on an entire surface of the displaying base board 502.However, in this case, the positive hole ejection layer 513A must bedisposed selectively according to each of the predetermined positions soas to prevent cross-talk. Therefore, it is quite effective to applyusing the gap 111. Hereinafter, in FIG. 40, the same reference numeralsare applied to corresponding members as shown in FIGS. 35 to 39D so asto omit the repeated explanation thereof.

Also, a display apparatus using the EL illuminating element can beprovided not only in a form of an active-matrix display apparatus, butalso in a form of a passive-matrix display apparatus as shown in FIGS.41A and 41B. FIGS. 41A and 41B show an EL apparatus in a manufacturingapparatus for an electrical optical apparatus according to the presentinvention. FIG. 41A is a plan view showing a wiring disposition of aplurality of a first bus wiring 550 and a second bus wiring 560 whichare disposed so as to be orthogonal to the first bus wiring 550. FIG.41B is a cross section viewed along B-B line in FIG. 41A. Hereinafter,in FIGS. 41A and 41B, the same reference numerals are applied tocorresponding members as shown in FIGS. 35 to 39D so as to omit therepeated explanation thereof. Also, the details in the manufacturingprocesses are the same as the embodiments shown in FIGS. 35 to 39D;therefore, explanation with reference to drawings are omitted.

In a display apparatus according to the embodiment shown in FIGS. 41Aand 41B, an insulating layer 570 made of, for example, SiO₂ are disposedso as to surround the predetermined position to which the illuminatingelement 513 is located. By doing this, a gap 535 is formed between thepredetermined position and the peripheral area. By doing this, it ispossible to prevent the functional liquid material from flowing to theperipheral area when the functional liquid material is appliedselectively. Also, it is possible to perform a patterning operation inhigh accuracy.

Furthermore, an active-matrix display apparatus is not limited toembodiments shown in FIGS. 35 to 39D. That is, an active-matrix displayapparatus can be provided according to any one of embodiments such asshown in, for example, FIGS. 42,43, 44, 45, 46, or 47.

In a display apparatus shown in FIG. 42, it is possible to perform apatterning operation in high accuracy by forming a gap 535 by using thepixel electrode 511. FIG. 42 is a cross section showing an intermediateprocess for manufacturing processes for a display apparatus. Theprevious and consequent processes are approximately the same as theembodiment shown in FIGS. 39A to 39D; therefore explanation withreference to drawings is omitted.

In the display apparatus shown in FIG. 42, the pixel electrode 511 isformed in larger thickness than an ordinary pixel electrode. By doingthis, a gap 535 is formed between the pixel electrode 511 and theperipheral area. That is, in the display apparatus shown in FIG. 42, apixel electrode 511 to which an optical member is applied later ishigher than the peripheral area therearound in convex shape.Furthermore, an optical member 540A as a precursor for forming apositive hole ejection layer 513A which is disposed under theilluminating element 513 is applied on a surface of the pixel electrode511 by an ink jet method similarly to embodiments shown in FIGS. 35 to39D.

However, the conditions are different from the embodiments shown inFIGS. 35 to 39D in that the optical member 540A is ejected by thedisplaying base board which is disposed vertically reversed, that is,under conditions that the top surface of the pixel electrode 511 towhich the optical member 540A is applied is directed downward. By doingthis, the optical member 540A remains on a top surface of the pixelelectrode 511 (on a downwarded surface in FIG. 42) by gravity andsurface tension; therefore, the optical member 540A does not expand tothe peripheral area. By doing this, the optical member 540A issolidified by heating processing or light emitting method, and it ispossible to form a thin positive hole ejection layer 513A which issimilar to the embodiment shown in FIG. 38B. By repeating theabove-explained processes, it is possible to form the positive holeejection layer 513A. The organic semiconductor layer 513B can be formedby a similar method. By doing this, it is possible to perform apatterning operation with high accuracy by using a convex gap. Here, itis acceptable that the ejection amount of the optical members 540A and540B be adjusted not only by gravity and surface tension, but also byinertia force such as centrifugal force.

A display apparatus shown in FIG. 43 is also an active-matrix displayapparatus. FIG. 43 shows a cross section of an intermediate process formanufacturing a display apparatus. The previous and consequent processesare approximately the same as the embodiment shown in FIGS. 35 to 39D;therefore, explanation with reference to drawings is omitted.

In the display apparatus shown in FIG. 43, at first, a reflectingelectrode 512 is formed on the displaying base board 502. Then, aninsulating layer 570 is formed on the reflecting electrode 512 so as tosurround the predetermined position on which the illuminating element513 is disposed later. By doing this, a gap 535 which is lower than theperipheral area therearound is formed in concave shape.

In addition, similarly to the cases of the embodiments shown in FIGS. 35to 39D, the illuminating element 513 is formed by ejecting and applyingthe optical members 540A and 540B as a functional liquid material in thearea which is surrounded by the gap 535 by ink jet method.

On the other hand, on the removal base board 580, the scan line 503, thesignal line 504, the pixel electrode 511, the switching thin filmtransistor 509, the current thin film transistor 510, and theinter-layer insulating layer 530 are formed via a removal layer 581.Finally, a structure which is removed from the removal layer 581 on theremoval base board 580 is printed on the displaying base board 502.

In the embodiment shown in FIG. 43, it is possible to reduce damage tothe scan line 503, the signal line 504, the pixel electrode 511, theswitching thin film transistor 509, the current thin film transistor510, and the inter-layer insulating layer 530 caused by application ofthe optical members 540A and 540B. Here, the present embodiment can beapplied to the passive-matrix displaying element.

A display apparatus shown in FIG. 44 is also an active-matrix displayapparatus. FIG. 44 shows a cross section of an intermediate process formanufacturing a display apparatus. The previous and consequent processesare approximately the same as the embodiment shown in FIGS. 35 to 39D;therefore, explanation with reference to drawings is omitted.

In the display apparatus shown in FIG. 44, a concave gap 535 is formedby using the inter-layer insulating layer 530. By doing this, it ispossible to use the inter-layer insulating layer 530 without causing newmanufacturing processes; thus, it is possible to prevent themanufacturing process from being greatly complicated. Here, it isacceptable for the inter-layer insulating layer 530 to be formed ofSiO₂, and for ultraviolet light or plasma of O₂, CF₃, or Ar to beemitted. Furthermore, it is acceptable for a surface of the pixelelectrode 511 to be exposed and for liquid optical members 540A and 540Bto be ejected and applied selectively. By doing this, a distribution inwhich volatility is high is formed along a surface of the inter-layerinsulating layer 530. Thus, the optical members 540A and 540B tend to becollected in the predetermined position by effects by the gap 535 andthe volatility of the inter-layer insulating layer 530.

In a display apparatus shown in FIG. 45, it is intended that the appliedoptical members 540A and 540B not expand to the peripheral area byintensify the hydrophilicity in the predetermined position to which theliquid optical members 540A and 540B are applied than the hydrophilicityin the peripheral area. FIG. 45 shows a cross section of an intermediateprocess for manufacturing a display apparatus. The previous andsubsequent processes are approximately the same as the embodiment shownin FIGS. 35 to 39D; therefore, explanation with reference to drawings isomitted.

In a display apparatus shown in FIG. 45, the inter-layer insulatinglayer 530 is formed, and after that, the amorphous silicon layer 590 isformed on a surface thereof. Volatility of the amouphous silicon layer590 is higher than volatility of the ITO contained in the pixelelectrode 511 relatively. Here, on a surface of the pixel electrode 511,a distribution of which hydrophilic property and volatility isrelatively higher than hydrophilicity and volatility in the peripheralarea can be formed. In addition, similarly to the embodiments shown inFIGS. 35 to 39D, by ejecting and applying the liquid optical members540A and 540B toward above the pixel electrode 511 selectively by inkjet method, the illuminating element 513 is formed, and finally, thereflecting electrode 512 is formed.

Here, the embodiment shown in FIG. 45 can be applied to thepassive-matrix display apparatus. Furthermore, similarly to theembodiment shown in FIG. 43, it is acceptable that the manufacturingprocess contain the process in which the structure which is formed onthe removal base board 580 via the removal layer 581 is transmitted onthe displaying base board 502.

Also, it is acceptable that the distribution of volatility andhydrophilicity be formed by metal or insulating layers such as anodeoxide layer, polyimide, or silicon oxide, or other material member.Here, the passive-matrix displaying element can be formed by the firstbus wiring 550. The active-matrix displaying element can be formed bythe scan line 503, the signal line 504, the pixel electrode 511, theinsulating layer 530, or the shielding layer 6 b.

In a display apparatus shown in FIG. 46, accuracy of the patterningoperation improves not by using the gap 535 of distribution ofvolatility and hydrophilicity, but by using the gravity due to theelectric potential and repulsive force. FIG. 46 shows a cross section ofan intermediate process for manufacturing a display apparatus. Theprevious and consequent processes are approximately the same as theembodiment shown in FIGS. 35 to 39D; therefore, explanation withreference to drawings is omitted.

In a display apparatus shown in FIG. 46, by driving the signal line 504and the common electricity supplying line 505 and turning on/off thetransistor appropriately, which is not shown in the drawing, potentialdistribution in which a potential of the pixel electrode 511 becomesnegative, and a potential of the inter-layer insulating layer 530becomes positive is formed. Furthermore, the liquid optical member 540Awhich is electrified in positive potential is ejected and applied to thepredetermined position by an ink jet method. By doing this, because theoptical member 540A is electrified, it is possible to use not onlyspontaneous polarization but also electrified charge; thus, it ispossible to improve the accuracy in the patterning operation.

Here, the embodiment shown in FIG. 46 can be applied to thepassive-matrix display apparatus. Furthermore, similarly to theembodiment shown in FIG. 43, it is acceptable for the manufacturingprocess to contain a process in which the structure which is formed onthe removal base board 580 via the removal layer 581 is transmitted onthe displaying base board 502.

Also, in the embodiment shown in FIG. 46, potentials are given to boththe pixel electrode 511 and the inter-layer insulating layer 530 whichis disposed therearound. However, the present invention is not limitedto the embodiment shown in FIG. 46. For example, as shown in FIG. 47, itis acceptable that a potential is not given to the pixel electrode 511and a potential is given only to the inter-layer insulating layer 530;furthermore, the liquid optical member 540A is electrified in positivepotential so as to be applied. According to the embodiment shown in FIG.47, because the liquid optical member 540A can maintain thepositively-electrified condition securely after the applying operation.Therefore, it is possible to prevent the liquid optical member 540A fromflowing to the peripheral area securely by the repulsive force betweenthe liquid optical member 540A and the inter-layer insulating layer 530which is disposed in the peripheral area thereof.

(Other Embodiments)

The preferable embodiments of the present invention were explainedabove. However, the present invention is not limited to the embodimentswhich are explained above. The present invention includes modifiedembodiments as follows. The invention disclosed herein may be variouslymodified and have alternative forms as long as they fall within thescope of the present invention as defined by the claims.

That is, for example, in the manufacturing apparatus for the colorfilter shown in FIGS. 8 and 9, by performing the main scanning of themotherboard 12 by moving the ink jet head 12 in the main scanningdirection X and by moving the motherboard 12 by the sub-scanning drivingapparatus 21, the sub-scanning operation for the motherboard 12 isperformed by the ink jet head 22. In contrast, it is acceptable for themain scanning operation to be performed by the movement of themotherboard 12 and the sub-scanning operation is performed by themovement of the ink jet head 22. Furthermore, it is acceptable for themotherboard 12 to be moved without moving the ink jet head 22, or atleast one of them is moved relatively such that the ink jet head 22moves relatively along the surface of the motherboard 12, that is, bothof them are moved relatively in an opposite direction.

Also, in the above-mentioned embodiment, the ink jet head 421 whichejects the ink by using the deflective transformation of thepiezoelectric element was used. It is possible to use ink jet headshaving any structure such as an ink jet head which ejects the ink byusing bubbles which are generated by heating operation.

Furthermore, in the embodiments shown in FIGS. 22 to 32, it wasexplained that nozzles 466 were disposed at equal interval on nearly aline in two arrays in the ink jet head 421. However, it is acceptablethat the nozzles are disposed not only in two arrays but also in aplurality of arrays, for example, more than 3 arrays. Also, it isaccepted that the disposition of the nozzles 466 are not in an equalinterval nor on a line in an array manner.

In addition, the liquid drop ejecting apparatuses 16 and 401 are notlimited to be used in the color filter 1, the liquid crystal apparatus101, and the EL apparatus 210. The liquid drop ejecting apparatuses 16and 401 can be used for various electrooptical apparatuses which have abase board (base member) and a process for forming a predetermined layerthereon such as an electron emission apparatus such as an FED (FieldEmission Display), a PDP (Plasma Display Panel), an electrophoreticapparatus which ejects the ink as a functional liquid materialcontaining a charged particle to a concave section between the bullheadof each pixel and charges a voltage between the electrodes which aredisposed so as to sandwich each of the pixels vertically and brings thecharged particle to either one of the electrodes so as to performdisplay operation in each of the pixels, thin Braun tube, and a CRT(Cathode-Ray tube) display.

The apparatuses and methods according to the present invention can beused for in manufacturing processes for various devices having a processfor ejecting the liquid drop 8 to the base board (base member) of thedevice such as an electrooptical apparatus having the base board (basemember). The apparatuses and methods according to the present inventioncan be used for, for example, structures in which a liquid metal, aconductive member, and a metal-contained painting member are ejected byan ink jet method so as to form a metal wiring, optical members such asfine micro-lenses which are formed on the base member by ink jet method,only necessary amount of resist is applied on the base board by ink jetmethod, concave sections or fine-white patterns for dispersing a lightare formed on a transparent base board such as a plastic member by inkjet method so as to form a light dispersing board, samples, antibodies,and DNA (deoxylibonucleic acid) are ejected to a position in a dotmanner which are separated on the base member by ink jet method so as toform a bio-tip; that is, RNA (ribonucleic acid) is ejected to a spikespot which is disposed in a matrix manner on a DNA chip by ink jetmethod so as to form a fluorescent probe such that the DNA chip canhybridize.

The apparatuses and methods according to the present invention can beused for a liquid crystal apparatus 101 such as an active-matrix liquidcrystal panel which is provided with a pixel such as a transistor suchas a TFT or an active element such as TFD. That is, the apparatuses andmethods according to the present invention can be used for a structurefor forming the electrooptical system for the liquid crystal apparatus101, for example, structures in which an ink is ejected by an ink jetmethod to a bulkhead 6 which is formed so as to surround the pixelelectrode so as to form a color filter 1, an ink containing a mixture ofcolor members and conductive member is ejected to the pixel electrode byink jet method so as to form a color filter 1 as a conductive colorfilter, a grain for a spacer for holding the gap between the base boardsis ejected by ink jet method.

Furthermore, the apparatuses and methods according to the presentinvention can be used not only for the color filter 1 but also for anykind of electrooptical apparatus such as an EL apparatus 201. Also, theEL apparatus 201 can be realized in various ways such as a stripedisplaying apparatus in which the ELs corresponding to three colors suchas those of R, G, and B are formed in a strip manner, an active-matrixdisplay apparatus which is provided with transistors for controlling theelectric current which flows in the illuminating layers with respect toeach pixel, and a passive-matrix display apparatus.

Here, the electronic devices to which an electrooptical apparatusaccording to the above-explained embodiments is assembled is not limitedto a personal computer 490 which is shown in FIG. 48. The electronicdevices to which an electrooptical apparatus according to theabove-explained embodiments is assembled can be applied to variouselectronic devices such as a mobile phone device such as a mobile phone491 or to a PHS (Personal Handyphone System) phone shown in FIG. 49, anelectronic pocketbook device, a pager, a POS (Point of Sales) terminal,an IC card, a mini-disk player, a liquid crystal projector, an EWS(engineering work-station), a word processor, a television, a videotaperecorder having a view finder or viewing monitor, an electronic desktopcalculator, a car-navigation device, an apparatus having a touch panel,a clock, a game device, or the like.

Additionally, specific structures and process for performing the presentinvention can be replaced by other structures and processes as long asthe objects for the present invention can be achieved. For example, inembodiments shown in FIGS. 23, 31, and 32, all of ink jet heads 421 aredisposed so as to be directed in one slanted direction. However, it isacceptable that one array among the two arrays be disposed in adirection which is rotated by 90 degrees from slanting angle of theother array. It is acceptable that two arrays of ink jet head aredisposed having 90 degrees with respect to each other without crossingeach other. It is acceptable for the neighboring head to be disposed soas to be at 90 degrees without crossing each other in each of the inkjet head arrays. As explained above, as long as these modifications donot contradict the purpose of the present invention, it is understoodthat any modification can be within the scope of the present invention.

1. An ejecting method using a plurality of liquid drop ejecting headsthat include a plurality of nozzles for ejecting a fluid liquidmaterial, comprising: relatively moving the plurality of liquid dropejecting heads, which are disposed in a direction that diagonallycrosses a direction in which the plurality of the nozzles move to ejectthe liquid material relative to a substance to receive the ejection,along a surface of the substance to receive the ejection so that asurface on which the plurality of nozzles of the plurality of liquiddrop ejecting heads are disposed faces the surface of the substance thatreceives the ejection with a space therebetween; and ejecting the liquidmaterial to the substance from each of the plurality of nozzles of theplurality of liquid drop ejecting heads.
 2. The ejecting methodaccording to claim 1, the plurality of the liquid drop ejecting headsbeing disposed in a direction that diagonally crosses a direction inwhich the plurality of liquid drop ejecting heads move relative to thesubstance to receive the ejection.
 3. The ejecting method according toclaim 1, the plurality of the liquid drop ejecting heads being formed insubstantially one shape.
 4. The ejecting method according to claim 1,each of the plurality of liquid drop ejecting heads including a samenumber of nozzles.
 5. The ejecting method according to claim 1, theplurality of nozzles being formed in same positions as the plurality ofliquid drop ejecting heads.
 6. The ejecting method according to claim 1,the plurality of nozzles of the plurality of liquid drop ejecting headsbeing disposed in arrays with nearly equal intervals.
 7. The ejectingmethod according to claim 1, the plurality of liquid drop ejecting headsbeing formed in a rectangle along a direction in which the plurality ofnozzles are disposed.
 8. The ejecting method according to claim 1, theplurality of nozzles of the plurality of liquid drop ejecting headsbeing disposed in parallel.
 9. The ejecting method according to claim 1,the plurality of nozzles of the plurality of liquid drop ejecting headsbeing disposed in a direction that diagonally crosses a direction inwhich the plurality of nozzles move relative to the substance to receivethe ejection and arrays of nozzles of the plurality of liquid dropejecting heads being disposed in parallel.
 10. The ejecting methodaccording to claim 1, a pair of neighboring liquid drop ejecting headsbeing disposed in a direction in which the plurality of liquid dropejecting heads move relative to the substance to receive the ejectionwhile portions of the liquid drop ejecting heads overlap each other. 11.The ejecting method according to claim 1, the plurality of liquid dropejecting heads being disposed in a plurality of staggered arrays. 12.The ejecting method according to claim 1, further comprising: performinga detecting-operation for ejection of the liquid material at least oneof before and after the ejecting of the liquid material from the nozzleto the substance.
 13. A manufacturing method for an electroopticalapparatus including a base board and color filters that are formed onthe base board for different colors, the color filter including aplurality of nozzles for ejecting a liquid material containing a filtermember of a predetermined color, the method comprising: relativelymoving a plurality of liquid drop ejecting heads, which are disposed ina direction that diagonally crosses a direction in which an array of theplurality of nozzles move relative to the base board, along a surface ofthe base board so that a surface including the plurality of nozzlesfaces a surface of the base board with a space therebetween.
 14. Amanufacturing method for an electrooptical apparatus, comprising:forming a plurality of color filters on a base board, the color filtersincluding different colors, each color filter being produced by aplurality of liquid drop ejecting heads, the plurality of liquid dropejecting heads including a plurality of nozzles that ejects a liquidmaterial containing a filter member of a predetermined color; andrelatively moving the plurality of liquid drop ejecting heads, which aredisposed in a direction that diagonally crosses a direction in which anarray of the plurality of nozzles move relative to the base board, alonga surface of the base board so that a surface including the plurality ofnozzles faces a surface of the base board with a space therebetween. 15.The manufacturing method according to claim 13, the plurality of liquiddrop ejecting heads being disposed in arrays in a direction thatdiagonally crosses a direction in which the liquid drop ejecting headsmove relative to the base board.
 16. The manufacturing method accordingto claim 37, a shape of each of the plurality of liquid drop ejectingheads being substantially the same.
 17. The manufacturing methodaccording to claim 37, each one of the plurality of liquid drop ejectingincluding a same number of nozzles.
 18. The manufacturing methodaccording to claim 37, each one of the plurality of liquid drop ejectingheads including a plurality of nozzles, each respective nozzle of theplurality of liquid drop ejecting heads including a same position. 19.The manufacturing method according to claim 37, each of the plurality ofliquid drop ejecting heads including the plurality of nozzles aligned inan array with a nearly equal interval.
 20. The manufacturing method foran electrooptical according to claim 37, the plurality of liquid dropejecting heads being formed in a nearly a rectangular shape along adirection of the plurality of nozzles.
 21. The manufacturing methodaccording to claim 37, the plurality of nozzles of the plurality ofliquid drop ejecting heads being disposed in nearly parallel arrays. 22.The manufacturing method according to claim 37, the array of theplurality of nozzles of the plurality of liquid drop ejecting headsbeing disposed in a direction that diagonally crosses a direction inwhich the nozzles move relative to the base board, and the array of theplurality of nozzles of the plurality of liquid drop ejecting headsbeing disposed so as to be parallel with each other.
 23. Themanufacturing method according to claim 37, the plurality of the liquiddrop ejecting heads being disposed in a plurality of staggered arrays.24. The manufacturing method according to claim 37, further comprising:detecting the ejection of the liquid material at least one of before,after and during the ejecting of the liquid material from the pluralityof nozzles to the substance.
 25. A manufacturing method for a colorfilter for forming different colors on a base board, the color filterincluding a plurality of nozzles for ejecting a liquid materialcontaining a color filter member of a predetermined color, the methodcomprising: relatively moving a plurality of liquid drop ejecting heads,which are disposed in a direction that diagonally crosses a direction inwhich an array of the plurality of nozzles move relative to the baseboard, along a surface of the base board so that a surface including theplurality of nozzles faces a surface of the base board with a spacetherebetween; and ejecting the color filter member from each of theplurality of nozzles of the plurality of liquid drop ejecting heads tothe base board.
 26. The manufacturing method according to claim 25, theplurality of liquid drop ejecting heads being disposed in a plurality ofarrays in a direction that diagonally crosses a direction in which theplurality of liquid drop ejecting heads move to the base boardrelatively.
 27. The manufacturing method according to claim 25 a shapeof the plurality of liquid drop ejecting heads being substantially thesame as each other.
 28. The manufacturing method according to claim 25,each of the plurality of liquid drop ejecting heads including a samenumber nozzles.
 29. The manufacturing method according to claim 25, eachone of the plurality of liquid drop ejecting heads including nozzlesthat include a same position as each other.
 30. The manufacturing methodaccording to claim 25, each of the plurality of liquid drop ejectingheads including the plurality of nozzles aligned in an array with anearly equal interval.
 31. The manufacturing method according to claim25, the plurality of liquid drop ejecting heads being formed in a nearlyrectangular shape along a direction in which the plurality of nozzlesare disposed.
 32. The manufacturing method according to claim 25, theplurality of nozzles of the plurality of liquid drop ejecting headsbeing disposed in nearly parallel arrays.
 33. The manufacturing methodaccording to claim 25, the array of the plurality of nozzles ofplurality of liquid drop ejecting heads being disposed in a directionthat diagonally crosses a direction in which the plurality of nozzlesmove relative to the base board, and the array of the plurality ofnozzles of the plurality of liquid drop ejecting heads being disposed soas to be parallel with each other.
 34. The manufacturing methodaccording to claim 25, the plurality of liquid drop ejecting heads beingdisposed in a plurality of staggered arrays.
 35. The manufacturingmethod according to claim 25, further comprising: detecting the ejectionof the liquid material at least one of before, after and during theejecting of the liquid material from the nozzle to the base board.
 36. Amanufacturing method for a device including a base member, apredetermined layer being formed on the base member by ejecting a liquidmaterial on the base member as a substance that receives the ejection bythe ejecting method according to claim
 1. 37. The manufacturing methodaccording to claim 13, further comprising: ejecting the liquid materialfrom the plurality of nozzles to a predetermined position of the baseboard.
 38. The manufacturing method according to claim 15, furthercomprising: ejecting the liquid material from the plurality of nozzlesto a predetermined position of the base board.